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A printed distributing board and a manufacture method of the same

A technology for printed wiring boards and manufacturing methods, which is applied in the direction of assembling printed circuits with electrical components, printed circuits connected with non-printed electrical components, etc., which can solve the problems of overall shape limitation, poor manufacturing efficiency, etc., and achieve space saving , to achieve the effect of manufacturing efficiency

Inactive Publication Date: 2012-10-31
SUMITOMO ELECTRIC PRINTED CIRCUITS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, in such a conventional printed wiring board, since the outline of a plurality of printed wiring boards of the same shape is punched out or cut out from one original board, the number of sheets that can be cut out from the original board ( The so-called acquisition quantity) is limited by the overall shape of the printed wiring board, and there is a problem of poor manufacturing efficiency

Method used

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  • A printed distributing board and a manufacture method of the same
  • A printed distributing board and a manufacture method of the same
  • A printed distributing board and a manufacture method of the same

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Embodiment Construction

[0033] In order to understand this invention, the printed wiring board which concerns on embodiment of this invention, and the manufacturing method of this printed wiring board are demonstrated, referring drawings below. However, the following description is an embodiment of the present invention, and does not limit the contents described in the claims. First, refer to figure 1 , figure 2 , the printed wiring board according to the embodiment of the present invention will be described.

[0034]The printed wiring board 1 according to the embodiment of the present invention is, for example, figure 1 , figure 2 As shown, the main body 10 having the electrode forming region K and the electronic component mounting portion 20 having the electrode forming region K and the electronic component mounting region B are integrally electrically connected through an anisotropic conductive adhesive 30 and formed by printing. patch panel.

[0035] The above-mentioned main body portion 1...

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Abstract

The invention provides a printed distributing board and a manufacture method of the same. High efficiency and low cost of the manufacture of the printed distributing board are realized and the printed distributing boards of various specifications can be manufacture efficiently. In the printed distributing board, a main body (10) provided with an electrode forming area (K) is electrically integrated with an electronic part installation part (20) provided with an electrode forming area (K) and an electronic part installation area (B); the electronic part installation part (20) is configured to be electrically connected with the electrode forming area (K) of the main body (10) at a portion of its electrode forming area (K) through anisotropic electric conduction adhesive (30); and the electronic part installation area (B) is made overlapped with the electrode forming area (K) through return of the electronic part installation part.

Description

technical field [0001] The present invention relates to a printed wiring board and a method of manufacturing the printed wiring board, which can achieve high manufacturing efficiency and low cost in printed wiring boards for mounting electronic components, and can efficiently To manufacture printed wiring boards of various specifications. Background technique [0002] Currently, in printed wiring boards on which electronic components are mounted, generally, a region for mounting electronic components (hereinafter referred to as an electronic component mounting region) and other regions are all formed on a single substrate. [0003] In addition, such conventional printed wiring boards are usually produced by punching out a plurality of printed wiring boards having the same shape from one original board with a punching machine from the viewpoint of manufacturing efficiency. The shape of the board. [0004] As a prior art showing such a printed wiring board, there is, for exa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/18H05K3/32
Inventor 内田淑文伊藤尚川岛健太
Owner SUMITOMO ELECTRIC PRINTED CIRCUITS INC
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