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Casing with ceramic surface and manufacturing method thereof

A manufacturing method and ceramic surface technology, applied in the direction of ceramic layered products, chemical instruments and methods, and plating of superimposed layers, can solve the problems of fragile electronic products, inability to conform to precision forming, and increased weight of electronic products. Achieve the effects of reducing variance, improving tolerance, and reducing shrinkage

Inactive Publication Date: 2012-10-31
ASUSTEK COMPUTER INC
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Problems solved by technology

The first is to directly use ceramic materials to make the entire shell, however, this will lead to a significant increase in the weight of the electronic product and make the electronic product easy to break
The second is to directly form a ceramic material on the surface of the metal shell, and then sinter and anneal to form a ceramic surface. However, the ceramic surface formed in this way has a very high shrinkage rate, which can be as high as 20-30%. , so that it cannot meet the needs of precision forming

Method used

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  • Casing with ceramic surface and manufacturing method thereof
  • Casing with ceramic surface and manufacturing method thereof
  • Casing with ceramic surface and manufacturing method thereof

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Embodiment Construction

[0011] A casing with a ceramic surface and a manufacturing method thereof according to preferred embodiments of the present invention will be described below with reference to related drawings, wherein the same components will be described with the same reference symbols.

[0012] figure 1 It is a flow chart of steps of a manufacturing method of a housing with a ceramic surface according to a preferred embodiment of the present invention, which includes steps S01 to S03. Figure 2A to Figure 2C It is a schematic diagram of the manufacturing method of the housing of this embodiment, please refer to figure 1 and Figure 2A to Figure 2C is shown to illustrate the manufacturing method of this embodiment.

[0013] Step S01 : forming a ceramic oxide layer 12 on a surface of a metal shell 11 . The material of the metal shell 11 may include at least one metal, at least one alloy or a combination thereof, wherein the metal is copper or iron, and the alloy is magnesium alloy, aluminu...

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Abstract

A manufacturing method of a casing with a ceramic surface comprises the steps of: forming a ceramic oxidation layer on a surface of a metal shell,forming a ceramic material on the ceramic oxidation layer,and sintering the ceramic material. Accordingly, the metal casing can be formed with a ceramic surface, which can solve the problem of high shrinkage rate.

Description

technical field [0001] The present invention relates to a casing and a manufacturing method thereof, in particular to a casing with a ceramic surface and a manufacturing method thereof. Background technique [0002] As the technology of electronic products matures day by day, the appearance of electronic products has also become an important key for consumers to choose. Currently, the most popular thing is to form a ceramic surface on the casing of electronic products, which can make electronic products have different and diversified feelings, thereby enhancing product competitiveness. [0003] Generally speaking, there are no more than two methods to manufacture a housing with a ceramic surface. The first is to directly use ceramic materials to make the entire casing, but this will greatly increase the weight of the electronic product and make the electronic product easy to break. The second is to directly form a ceramic material on the surface of the metal shell, and the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/00B32B15/04B32B18/00B32B37/02
CPCB32B15/04B32B18/00H05K5/00C23C28/04B32B37/02
Inventor 杨斐琳邱杨博卓俊凯
Owner ASUSTEK COMPUTER INC
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