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Solid-state imaging device, manufacturing method of solid-state imaging device, and electronic device

A technology of solid-state imaging device and conductive layer, which is applied to electric solid-state devices, radiation control devices, televisions, etc., can solve problems such as electrostatic dust adhesion, and achieve the effect of inhibiting adhesion and dust adhesion.

Active Publication Date: 2017-04-12
SONY SEMICON SOLUTIONS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the problem of electrostatic dust etc. adhering to the wire grid polarizer may occur

Method used

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  • Solid-state imaging device, manufacturing method of solid-state imaging device, and electronic device
  • Solid-state imaging device, manufacturing method of solid-state imaging device, and electronic device
  • Solid-state imaging device, manufacturing method of solid-state imaging device, and electronic device

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Embodiment Construction

[0023] Embodiments of the present invention will be described below, but the present invention is not limited to the following examples.

[0024] Descriptions are given in the following order.

[0025] 1. Embodiment of a solid-state imaging device

[0026] 2. Embodiment of the manufacturing method of the solid-state imaging device

[0027] 3. Modified example of solid-state imaging device

[0028] 4. Implementation of Electronic Devices

[0029]

[0030] [Structure Example of Solid-State Imaging Device: Schematic Structural Diagram]

[0031] Next, specific embodiments of the solid-state imaging device of this embodiment will be described.

[0032] figure 1 A schematic configuration diagram showing a MOS (Metal Oxide Semiconductor) type solid-state imaging device as an example of the solid-state imaging device.

[0033] figure 1 The illustrated solid-state imaging device 10 includes a pixel unit (so-called imaging region) 13 in which pixels 12 are regularly arranged tw...

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Abstract

The present invention provides a solid-state imaging device, a manufacturing method thereof, and electronic equipment including the solid-state imaging device. The solid-state imaging device includes: a photoelectric conversion element; a wire grid polarizer provided on the photoelectric conversion element; and a conductive film electrically connecting a conductive layer provided in the photoelectric conversion element to the wire grid polarizer. The present invention can suppress electrostatic dust from adhering to the wire grid polarizer.

Description

[0001] Cross References to Related Applications [0002] This application contains related subject matter disclosed in and claims priority from Japanese Patent Application JP2011-104897 filed in the Japan Patent Office on May 10, 2011, the entire contents of which are hereby incorporated by reference. technical field [0003] The present invention relates to a solid-state imaging device having a wire grid polarizer (WGP), a method of manufacturing the solid-state imaging device, and electronic equipment including the solid-state imaging device. Background technique [0004] In solid-state imaging devices such as CCD image sensors and CMOS image sensors, optical systems including polarizers are used. In particular, in the application of stereoscopic video (3D) as a function of video cameras, digital cameras, portable devices, etc., polarizers are often used due to the need to separately process light for the right eye and light for the left eye. In general, a polarizer in a ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/146G02B5/30
CPCG02B5/3058H01L27/14618H01L27/14629H01L2224/48091H01L2224/45144H04N13/225H01L27/1464H04N23/811H01L2924/00014H01L2924/00
Inventor 福田圭基
Owner SONY SEMICON SOLUTIONS CORP