Manufacturing method of corona-resistant polyimide film sintered enamelled copper strap wires
A technology of polyimide film and manufacturing method, which is applied in the direction of cable/conductor manufacturing, circuit, electrical components, etc., can solve the problems of being unable to withstand high temperature, high pressure, and limited mechanical properties, and achieve strong mechanical properties and increase corona resistance High performance and high corona resistance
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Embodiment 1
[0026] A method for manufacturing a corona-resistant polyimide film sintered enamelled flat copper wire, the steps comprising:
[0027]A. Process copper conductors to make copper flat wires: first transport the copper plate to the copper plate holding furnace, the temperature of the copper plate holding furnace is 1150°C, cover the surface of the copper plate with baked charcoal to remove oxygen, and the covering thickness is 100mm. Melt the copper plate into copper liquid, insert the crystallizer into the copper liquid to a depth of 130mm, the water inlet starts to enter the water, the water inlet temperature is 30°C, and the water inlet pressure is 0.20MPa, after the copper liquid is cooled and formed, the draw bar pulls and forms the round wire billet. Traction air pressure of disc and lead rod is 0.25MPa;
[0028] The round wire billet is continuously extruded to form a flat copper wire. During extrusion production, the compaction pressure is 40MPa, the tooling is cooled, ...
Embodiment 2
[0032] A method for manufacturing a corona-resistant polyimide film sintered enamelled flat copper wire, the steps comprising:
[0033] A. Process copper conductors to make copper flat wires: first transport the copper plate to the copper plate holding furnace, the temperature of the copper plate holding furnace is 1180°C, cover the surface of the copper plate with baked charcoal to remove oxygen, and the covering thickness is 150mm. Melt the copper plate into copper liquid, insert the crystallizer into the copper liquid to a depth of 140mm, the water inlet starts to enter the water, the temperature of the water is 35°C, and the pressure of the water is 0.35MPa. , draw rod traction air pressure 0.30MPa;
[0034] The round wire billet is formed into a flat copper wire by continuous extrusion. During extrusion production, the compaction pressure is 40MPa, the tooling is cooled, the temperature is 60°C, the current is controlled at 180A, and the extrusion temperature is maintaine...
Embodiment 3
[0038] A method for manufacturing a corona-resistant polyimide film sintered enamelled flat copper wire, the steps comprising:
[0039] A. Process copper conductors to make copper flat wires: first transport the copper plate to the copper plate holding furnace, the temperature of the copper plate holding furnace is 1165°C, cover the surface of the copper plate with baked charcoal to remove oxygen, and the covering thickness is 120mm. Melt the copper plate into copper liquid, insert the crystallizer into the copper liquid to a depth of 135mm, the water inlet starts to enter the water, the temperature of the water is 332°C, and the pressure of the water is 0.25MPa. , draw bar traction air pressure 0.27MPa;
[0040] The round wire billet is continuously extruded to form a flat copper wire. During extrusion production, the compaction pressure is 40MPa, the tooling is cooled, the temperature is 50°C, the current is controlled at 170A, and the extrusion temperature is maintained at ...
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