Preparation method of high-low frequency hybrid-voltage printed circuit board

Abstract

The invention discloses a preparation method of a high-low frequency hybrid-voltage printed circuit board, belonging to the technical field of printed circuit board manufacturing. The method comprises the step of adding counterpoint edges 2023 and 2033 on a low-frequency main body substrate 202 and a high frequency embedding board 203, wherein acounterpoint detecting holes and alignment testing rectangular windows are respectively formed at the added counterpoint edges. The alignment of the low frequency main body substrate with the high frequency embedding board is improved greatly, the destructive detection to the low frequency main body substrate and the high frequency embedding board after being laminated is reduced, and meanwhile the material quantity of the high frequency embedding board is reduced.

Description

technical field [0001] The invention belongs to the technical field of printed circuit board manufacturing, and relates to a high-low frequency mixed voltage printed circuit board, especially a preparation method of a high and low frequency mixed voltage printed circuit board with good heat dissipation performance. Background technique [0002] The development trend of miniaturization, high density and multi-function of electronic information products requires to improve the signal transmission speed (frequency) and heat dissipation performance of Printed Circuit Board (PCB). The materials used in traditional high-frequency PCB manufacturing are relatively expensive, which is not conducive to the popularization of high-frequency signal designs with high electrical performance in civilian electronic information products. The outer layer of the multi-layer circuit board is mixed with high-frequency board or a small piece of high-frequency board is embedded in the outer core bo...

AI Technical Summary

Problems solved by technology

[0004] The invention provides a method for preparing a high-low frequency mixed-pressure printed circuit board. The method is to embed a high-frequency embedding plate on the top layer of the low-frequency main substrate, and embed a metal heat dissipation plate on the bottom layer of the low-frequency main substrate through process edge riveting and positioning. It solves the problem of the alignment between the main substrate and the high-frequency embedded board, reduces the destructive inspection after the low-frequency main substrate and the high-frequency embedded board are laminated, and the obtained multi-layer board meets the requirements of high-frequency circuit design and local high heat dissipation

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