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Spalling methods to form multi-junction photovoltaic structure and photovoltaic device

A germanium substrate and stress technology, applied in the field of photovoltaic device manufacturing, can solve the problems of cost deterioration, high cost, energy conversion waste, etc.

Inactive Publication Date: 2015-07-22
GLOBALFOUNDRIES INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The high costs associated with the manufacture of semiconductor materials degrade the cost per watt of a given photovoltaic technology
And, it can be argued that, at the device level, expensive semiconductor materials that do not contribute to energy conversion are a waste

Method used

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Embodiment Construction

[0018] Detailed embodiments of the claimed structures and methods are disclosed herein; however, it should be understood that the disclosed embodiments are merely illustrative of the claimed structures and methods that may be embodied in various forms. In addition, each of the examples given in connection with the various embodiments is intended to be illustrative, not restrictive. Furthermore, the figures are not necessarily to scale and some features may be exaggerated to show details of particular components. Therefore, specific structural and functional details disclosed herein are not to be interpreted as limiting, but merely as a representative basis for teaching one skilled in the art to variously employ the methods and structures of the present disclosure.

[0019] References in the specification to "one embodiment," "an embodiment," "exemplary embodiment," etc. mean that the described embodiments may include a particular feature, structure, or characteristic, but that...

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Abstract

A method cleaving a semiconductor material that includes providing a germanium substrate having a germanium and tin alloy layer is present therein. A stressor layer is deposited on a surface of the germanium substrate. A stress from the stressor layer is applied to the germanium substrate, in which the stress cleaves the germanium substrate to provide a cleaved surface. The cleaved surface of the germanium substrate is then selective to the germanium and tin alloy layer of the germanium substrate. In another embodiment, the germanium and tin alloy layer may function as a fracture plane during a spalling method.

Description

technical field [0001] The present disclosure relates to photovoltaic device fabrication, and in particular, to methods for controlled removal of surface layers from substrates by utilizing spalling. Background technique [0002] Photovoltaic devices are devices that convert the energy of incident photons into electromotive force (e.f.m.). Typical photovoltaic devices include solar cells configured to convert energy in electromagnetic radiation from the sun into electrical energy. Multi-junction solar cells including compound semiconductors can be used for power generation in space due to their high efficiency and radiation stability. Due to the inherently strong (IR) absorption properties of germanium (Ge), multi-junction solar cells are mainly fabricated on germanium (Ge) substrates. Germanium (Ge) also contains crystal structures that can lattice match III-V compound semiconductors, which allows the integration of III-V subcells on germanium (Ge) substrates. The german...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/304H01L31/18H01L31/0352H01L31/076
CPCH01L31/0687H01L31/0725H01L21/02532H01L31/0304H01L21/304H01L31/0312H01L31/075H01L31/06875H01L31/1892H01L31/1808H01L21/0262H01L31/074H01L21/02535H01L31/076Y02E10/544H01L31/1852H01L31/0745Y02E10/548Y02P70/50H01L21/76251H01L21/76254H01L31/1812H01L31/1896
Inventor S·W·贝德尔D·A·萨达纳D·沙杰迪
Owner GLOBALFOUNDRIES INC