A waterproof workpiece

A technology for workpieces and waterproof layers, applied to digital data processing parts, cooling/ventilation/heating transformation, instruments, etc., can solve problems such as waterproof performance degradation, achieve good waterproof effect, and reduce costs

Active Publication Date: 2017-02-08
LENOVO (BEIJING) LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The opening (vent) on the aluminum foil of the keyboard above the fan can partially solve the heat dissipation problem, but the waterproof performance of the fan, keyboard and internal CPU and other hardware is greatly reduced

Method used

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  • A waterproof workpiece
  • A waterproof workpiece
  • A waterproof workpiece

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0060] Such as image 3 As shown, it is a disassembled view of a notebook computer keyboard, including: a key 1, a bottom plate and a keyboard mechanism part 2, an aluminum foil 3 with micro-holes, and a cable 4; the aluminum foil 3 also includes a micro-hole area 5. The button 1, the bottom plate and the keyboard mechanism part 2, the aluminum foil 3 with micro holes, and the cable 4 are arranged according to the image 3 Place and assemble in order, which is the keyboard of the notebook computer.

Embodiment 2

[0062] Take an aluminum foil with a thickness of 0.1mm and a size of 200mm×450mm, spray a polytetrafluoroethylene waterproof coating with a concentration of 0.1wt% on the surface of the aluminum foil, and form a waterproof layer with a thickness of 20nm on the surface of the aluminum foil after curing.

[0063] Microholes are formed on the aluminum foil with a waterproof layer by laser engraving, the laser pulse frequency wavelength is 1060nm, the laser pulse power is 200W, the diameter of the microholes is 0.03mm, and the size of the micropore area is 50×50mm. The aluminum foil formed with micropores and the image 3 The sequence shown is attached under the keyboard chassis, the keyboard is assembled and installed in the notebook case.

[0064] The thickness of the thinnest part of the notebook keyboard prepared in this embodiment is 1 mm, and the thickness of the thickest part is 1.5 mm.

Embodiment 3

[0066] Take an aluminum foil with a thickness of 0.15mm and a size of 200mm×450mm, spray a polytetrafluoroethylene waterproof coating with a concentration of 0.1wt% on the surface of the aluminum foil, and form a waterproof layer with a thickness of 30nm on the surface of the aluminum foil after curing.

[0067] Microholes were formed on the aluminum foil with waterproof layer by laser engraving, the laser pulse frequency wavelength was 1060nm, the laser pulse power was 200W, the diameter of the microholes was 0.035mm, and the size of the micropore area was 50×60mm. The aluminum foil formed with micropores and the image 3 The sequence shown is attached under the keyboard chassis, the keyboard is assembled and installed in the notebook case.

[0068] The thickness of the thinnest part of the notebook keyboard prepared in this embodiment is 1.15 mm, and the thickness of the thickest part is 1.65 mm.

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Abstract

The invention provides a water-proof workpiece which comprises a metal body. At least one micropore formed under a first condition is arranged on the metal body, wherein gas flow and / or gas exchange on two sides of metal body are / or is achieved through the at least one micropore, and liquid can not flow from one side of the water-proof workpiece to the other side through the at least one micropore. According to the water-proof workpiece, the manufacturing cost of workpieces is reduced, and produced workpieces have high radiation performance and the advantage of being light and thin. The invention further provides an electronic device including the water-proof workpiece.

Description

technical field [0001] The invention relates to the field of electronic products and its manufacture, in particular to a workpiece and its preparation method. Background technique [0002] At present, the requirements for thin, light and portable notebook computer products continue to increase. Objectively, this requirement compresses the overall design space of internal components, especially the cooling module. This requires that on the premise of continuous improvement of the system platform, the working efficiency of the cooling module should be improved at a faster speed. [0003] At present, the heat dissipation design of notebook computers mainly adopts a passive heat dissipation method, that is, heat pipes are used to conduct heat energy generated by the CPU to heat dissipation fins. The fan rotates to inhale gas through the lower air inlet and blow the gas out of the air outlet through the cooling fins to reduce the temperature of the cooling fins. This design re...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20G06F1/20
Inventor 郝宁尤德涛江光军吴冰洁
Owner LENOVO (BEIJING) LTD
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