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Production process improvement method of flexible printed circuit board containing welding finger

A flexible circuit board and manufacturing process technology, which is applied in the direction of the electrical connection of printed components, can solve the problems of poor soldering finger pad misalignment, ineffective control of soldering fingers, and poor quality of semi-circular arc holes, etc., to achieve the solution of semi-circular arc The effect of offset

Active Publication Date: 2013-01-16
厦门爱谱生电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Conventional manufacturing methods cannot effectively control the size of the double-sided pads of the welding fingers and the size of the semi-circular arc holes, and there are deficiencies and limitations, which may lead to poor misalignment of the pads of some welding fingers and poor quality of the semi-circular arc holes.

Method used

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  • Production process improvement method of flexible printed circuit board containing welding finger
  • Production process improvement method of flexible printed circuit board containing welding finger
  • Production process improvement method of flexible printed circuit board containing welding finger

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Embodiment Construction

[0020] The present invention will be further described in conjunction with the accompanying drawings and specific embodiments.

[0021] refer to figure 1 Shown is a structure of a flexible circuit board with soldering fingers, a conductive metal layer 2 is formed on a flexible insulating substrate 1; generally, the conductive metal layer 2 is also covered with a layer of solder resist layer 3 , in order to protect the conductive metal layer 2 from being damaged during welding, the welding finger area 4 is provided with finger pads and drilled to achieve.

[0022] Figure 2a and Figure 2b Shown are the front and back sides of the flex circuit board with soldered fingers, respectively. It can be seen from the figure that each finger pad on the double-layer FPC has two metallized holes (PTH), one of which is a full circle hole located in the middle of the finger pad, and the other is located at the end of the finger pad The semi-arc climbing tin hole. Qualified flexible cir...

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PUM

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Abstract

The invention relates to the field of the manufacturing of a flexible printed circuit board (FPC). The invention relates to a production process improvement method of a FPC containing a welding finger, and the method comprises a manufacturing process as: A, blanking; B, drilling; C, sinking copper plating; D, exposing and aligning; E, circuit formation; F, circuit detection; G, surface treatment and electric energy test; H, appearance detection; and I, detection and packaging. The main improved flow is as follows: B, drilling, to be specific, drilling a semi-arc tin climbing hole, a circular hole and a mold positioning hole of a finger soldering pad together; D, exposing and aligning, to be specific, producing a dislocated mark in an area outside a circuit on a film negative, and realizing the aligning of the film negative of an exposed circuit by utilizing the socket Pin aligning; and F, circuit detection, to be specific, besides the detection of conventional items, detecting whether the dislocated mark on the FPC is aligned or not. The method is used for manufacturing the FPC of a welding finger with excellent quality.

Description

technical field [0001] The invention relates to the field of FPC (flexible circuit board) manufacturing, especially the improvement of the manufacturing process of the flexible circuit board containing welding fingers. Background technique [0002] One of the products of the flexible circuit board (FPC) is a flexible circuit board with soldering fingers, specifically, there are two metallized holes (PTH) on each finger pad on the double-layer FPC, one of which is a full circle hole, Located in the middle of the finger pad, the other is a semi-circular solder hole at the end of the finger pad; through these two holes on the finger pad, it is used to solder the FPC soft board to the PCB hard board. [0003] The general manufacturing process of flexible circuit boards with soldering fingers is: material cutting → drilling (the holes corresponding to the semi-circular arc and the full circle of the product are realized by drilling, and the positioning holes of the mold are reali...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/40
Inventor 邹平
Owner 厦门爱谱生电子科技有限公司
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