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loading device

A loading device and driving device technology, applied in the direction of transportation and packaging, conveyor objects, electrical components, etc., can solve the problems of cost increase, wafer scrapping, waste, etc., and achieve the effect of avoiding waste and saving costs

Active Publication Date: 2016-09-07
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the existing wafer loading device is likely to cause scratches on the wafer surface, resulting in the scrapping of the wafer, resulting in waste and increased costs

Method used

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Examples

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example 1

[0060] Please refer to Figure 6 , Figure 6 It is a schematic diagram of the first example of the sensor system in the loading device of the embodiment of the present invention, including: a sensor 205 for detecting whether the manipulator 202 is offset; a drive unit 240 connected with the sensor 205 for receiving information from the sensor 205 signal, and stop the first driving device 206 according to the signal.

[0061] The driving unit 240 is used to control the first driving device 206 and the second driving device 208 to work or stop according to the instructions received; the driving unit 240 includes a first driving unit 2401 and a second driving unit 2402; The first driving unit 2401 is connected with the first driving device 206 for controlling the operation and stop of the first driving device 206; the second driving unit 2402 is connected with the second driving device 208 for controlling the second driving device 206; The operation and stop of the driving devi...

example 2

[0065] Figure 8 It is a schematic diagram of the second example of the sensor system in the loading device of the embodiment of the present invention, including: a sensor 205 for detecting whether the manipulator 202 is offset; a first power supply unit 2061 for controlling the power on of the first driving device 206 or disconnected, the first power supply unit 2061 is connected to the sensor 205 .

[0066] When the sensor 205 is triggered, it sends a disconnection signal to the first power supply unit 2061, so that the first driving device 206 is powered off, thereby stopping the work of the first driving device 206, so as to stop the manipulator from continuing to move .

[0067] In this embodiment, a sensor 205 is set between the card slot 204 and the input valve 201, the sensor 205 is lower than the standard horizontal position of the manipulator 202, and the sensor 205 is higher than the lower layer of the manipulator 202 because the sensor 205 is connected to the fir...

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PUM

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Abstract

The invention relates to a loading device, which comprises a cavity, a mechanical arm arranged corresponding to an input valve, a base located in the cavity, a plurality of overlaid clamped slots, and a sensor fixed between the clamped slots and the input valve, wherein the input valve is arranged on a side wall of the cavity; the mechanical arm is connected with a first drive device and is used for supporting a wafer to be horizontally transmitted into the cavity from the outside of the input valve; the base is connected with a second drive device and is used for driving the base to move up and down relative to the cavity; the clamped slots are fixed on a surface of the base and are used for fixing the wafer above the base; the sensor is lower than a standard horizontal position of the mechanical arm and is higher than a surface of the wafer on a lower layer of the mechanical arm; the standard horizontal position of the mechanical arm is a horizontal position of the mechanical arm after entering the cavity through the input valve when the mechanical arm is not deviated; and the sensor is connected with the first drive device, and the movement of the mechanical arm is stopped by the first drive device controlled by a signal generated by the sensor. The loading device can avoid scratching the wafer.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a loading device. Background technique [0002] In an existing semiconductor manufacturing process, a film forming device or a dry etching device generally includes a process device, a loading device, and a transfer device between the process device and the loading device. Wherein, the process device is used to form a film on the surface of the wafer or to etch the wafer; the transfer device is used to transfer the wafer between the process device and the loading device; the loading device is used to load the wafer Circle, and realize mutual conversion between atmospheric pressure environment and vacuum environment. [0003] For prior art wafer loading devices, please refer to figure 1 , including: a chamber 100, the chamber 100 communicates with the gas supply channel 101, the exhaust channel 102 and the air pressure balance channel 103; the side wall of th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/687H01L21/677
Inventor 傅荣颢黄锦才
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP