Base plate and cutting method thereof

A technology for substrates and array substrates, applied in glass cutting devices, optics, glass manufacturing equipment, etc., can solve the problems of misjudgment by inspection machines and increase the burden on staff, and achieve the effects of reducing misjudgment, reducing burden, and speeding up

Active Publication Date: 2015-04-15
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, this splitting method has the following problems:
[0006] 3. The formed slope and gap may be within the allowable accuracy, but in the actual process, it may cause misjudgment of the inspection machine and increase the burden on the staff

Method used

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  • Base plate and cutting method thereof
  • Base plate and cutting method thereof
  • Base plate and cutting method thereof

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Embodiment Construction

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0025] see image 3 , image 3 It is a schematic flow chart of an embodiment of the cutting method of the substrate of the present invention. The substrate includes a first substrate and a second substrate, the first substrate includes a first surface and a second surface opposite to the first surface, and the second substrate includes a first surface and a second surface opposite to the first surface. Wherein, the first substrate is a thin film transistor a...

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PUM

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Abstract

A substrate and cut-cracking method thereof, capable of accelerating substrate cut-cracking speed, and reducing obliquity and offset after the cut-cracking, thus reducing the misjudgment of an inspection machine, and alleviating the burden on workers. The cut-cracking method comprises: forming an etched groove on the first surface (101) of a first substrate (10) and the first surface (201) of a second substrate (20) respectively; aligning and fitting the first surface (101) of the first substrate (10) with the first surface (201) of the second substrate (20) along the etched groove; on the second surface (102) of the first substrate (10) and the second surface (202) of the second substrate (20), using a knife flywheel to cut the first substrate (10) and the second substrate (20) respectively along the cutting line, such that the cutting-formed vertical cracks extend to the etched groove (30), thus cutting the first substrate (10) off the second substrate (20).

Description

technical field [0001] The invention relates to the technical field of liquid crystal panel manufacture, in particular to a substrate and a cutting method thereof. Background technique [0002] In the prior art, the cutting of liquid crystal substrates mostly adopts the method of knife wheel cutting, please refer to figure 1 and figure 2 , figure 1 It is a schematic diagram of the principle of the cutting method of the substrate in the prior art, figure 2 It is a schematic diagram of the cross-sectional structure after the substrate is cut in the prior art. The cutting method is specifically as follows: using the cutter wheel 100 to apply pressure to one side of the substrate 200, causing the surface to be damaged to form rib-shaped cracks 300, the rib-shaped cracks 300 are divided into horizontal cracks 301 and vertical cracks 302, and then the substrate 200 Pressure is applied to the surface of the other side to extend the vertical crack 302 ( figure 1 middle dotted...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C03B33/02G02F1/1333G02F1/1335
CPCG02F1/133351C03B33/033B28D1/225C03B33/023
Inventor 陈信华
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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