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Light emitting diode (LED) packaging structure

A technology for light-emitting diodes and packaging structures, which is applied to electrical components, circuits, semiconductor devices, etc., can solve the problems of not being able to emit all the forward directions, the light-emitting efficiency of the light-emitting diode packaging structure being reduced, and affecting the light-emitting performance of the light-emitting diode packaging structure.

Active Publication Date: 2013-02-13
常熟东南高新技术创业服务有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this light-emitting diode packaging structure, due to the existence of the gap, part of the light emitted by the light-emitting diode passes through the gap to the back of the light-emitting diode packaging structure, and cannot all be emitted forward, resulting in light emission from the light-emitting diode packaging structure. The decline in efficiency affects the light extraction performance of the light emitting diode packaging structure

Method used

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  • Light emitting diode (LED) packaging structure
  • Light emitting diode (LED) packaging structure

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Embodiment Construction

[0011] see figure 1 , An embodiment of the present invention provides a light emitting diode packaging structure 10 , which includes an electrode 11 , a light emitting diode chip 12 , a reflective cup 13 , an insulating layer 14 and a packaging layer 15 .

[0012] There are at least two electrodes 11 , a gap 16 is formed between two adjacent electrodes 11 , and the electrodes 11 are electrically insulated from each other. Each electrode 11 is flat and includes an upper surface 111 , a lower surface 112 opposite to the upper surface 111 and parallel to each other, and an inclined surface 113 connected between opposite ends of the upper surface 111 and the lower surface 112 . The slope 113 is located close to the gap 16 between two adjacent electrodes 11 . In this embodiment, the slope 113 is a plane, and is distributed on both sides of the gap 16 in an inverted splayed shape. Each slope 113 is downward from the end of the upper surface 111 of the corresponding electrode 11 clo...

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Abstract

The invention relates to a light emitting diode (LED) packaging structure. The LED packaging structure comprises a plurality of electrodes, an LED chip and a packaging layer, wherein a gap is formed between every two adjacent electrodes; the LED chip is electrically connected with the electrodes and coated in the packaging layer; an oblique surface is formed on each electrode close to the corresponding gap; and each oblique surface obliquely extends from one end of the corresponding electrode, which is close to the packaging layer, to the gap downwards, so that light which irradiates the oblique surface is reflected by the oblique surface and then emergent from the packaging layer.

Description

technical field [0001] The invention relates to a semiconductor structure, in particular to a light emitting diode packaging structure. Background technique [0002] At present, the packaging structure of a light emitting diode (Light Emitting Diode, LED) generally includes a plurality of electrodes, and a certain distance is spaced between two adjacent electrodes to form a gap and be insulated from each other. However, in this light-emitting diode packaging structure, due to the existence of the gap, part of the light emitted by the light-emitting diode passes through the gap to the back of the light-emitting diode packaging structure, and cannot all be emitted forward, resulting in light emission from the light-emitting diode packaging structure. The drop in efficiency affects the light extraction performance of the light emitting diode packaging structure. Contents of the invention [0003] In view of this, it is necessary to provide a light emitting diode packaging st...

Claims

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Application Information

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IPC IPC(8): H01L33/62H01L33/48
Inventor 林新强
Owner 常熟东南高新技术创业服务有限公司