Light emitting diode (LED) packaging structure
A technology for light-emitting diodes and packaging structures, which is applied to electrical components, circuits, semiconductor devices, etc., can solve problems such as affecting the light-emitting performance of the light-emitting diode packaging structure, not being able to emit all of the light in the forward direction, and reducing the light-emitting efficiency of the light-emitting diode packaging structure.
Active Publication Date: 2015-01-07
常熟东南高新技术创业服务有限公司
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Problems solved by technology
However, in this light-emitting diode packaging structure, due to the existence of the gap, part of the light emitted by the light-emitting diode passes through the gap to the back of the light-emitting diode packaging structure, and cannot all be emitted forward, resulting in light emission from the light-emitting diode packaging structure. The decline in efficiency affects the light extraction performance of the light emitting diode packaging structure
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[0011] see figure 1 , an embodiment of the present invention provides a light-emitting diode packaging structure 10 , which includes an electrode 11 , a light-emitting diode chip 12 , a reflector cup 13 , an insulating layer 14 and a packaging layer 15 .
[0012] There are at least two electrodes 11 , two adjacent electrodes 11 are spaced apart from each other to form a gap 16 , and the electrodes 11 are electrically insulated from each other. Each electrode 11 is in the shape of a flat plate, and includes an upper surface 111 , a lower surface 112 opposite to the upper surface 111 and parallel to each other, and an inclined surface 113 connected between opposite ends of the upper surface 111 and the lower surface 112 . The inclined surface 113 is located close to the gap 16 between two adjacent electrodes 11 . In this embodiment, the inclined surfaces 113 are flat and distributed on both sides of the gap 16 in an inverted figure-eight shape. Each inclined surface 113 descend...
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The invention relates to a light emitting diode (LED) packaging structure. The LED packaging structure comprises a plurality of electrodes, an LED chip and a packaging layer, wherein a gap is formed between every two adjacent electrodes; the LED chip is electrically connected with the electrodes and coated in the packaging layer; an oblique surface is formed on each electrode close to the corresponding gap; and each oblique surface obliquely extends from one end of the corresponding electrode, which is close to the packaging layer, to the gap downwards, so that light which irradiates the oblique surface is reflected by the oblique surface and then emergent from the packaging layer.
Description
technical field [0001] The present invention relates to a semiconductor structure, in particular to a light emitting diode packaging structure. Background technique [0002] At present, a light emitting diode (Light Emitting Diode, LED) package structure usually includes a plurality of electrodes, and two adjacent electrodes are separated by a certain distance to form a gap and are insulated from each other. However, in this light emitting diode package structure, due to the existence of the gap, part of the light emitted by the light emitting diode is directed toward the back of the light emitting diode package structure through the gap, and cannot be all emitted forward, thus causing the light emitting diode package structure to emit light. The drop in efficiency affects the light extraction performance of the light emitting diode package structure. SUMMARY OF THE INVENTION [0003] In view of this, it is necessary to provide a light emitting diode package structure wit...
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IPC IPC(8): H01L33/62H01L33/48
Inventor 林新强
Owner 常熟东南高新技术创业服务有限公司