Microcapsule-type latent curing agent for epoxy resin and process for production thereof

A technology for epoxy resin and manufacturing method, which is applied in the direction of microcapsule preparation, microsphere preparation, etc., which can solve the problems of inability to mix in large quantities in advance, complicated storage and operation, and limited service life, and achieve excellent storage stability and good storage Stability and productivity improvement effects

Inactive Publication Date: 2013-02-20
HITACHI CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The two-component epoxy resin composition can be cured at room temperature, but the epoxy resin and the curing agent must be stored separately, and the two must be weighed and mixed as needed, so storage and handling are complicated
In addition, due to the limited service life, it is impossible to pre-mix a large amount, and the frequency of mixing becomes higher, and the decrease in efficiency cannot be avoided

Method used

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  • Microcapsule-type latent curing agent for epoxy resin and process for production thereof
  • Microcapsule-type latent curing agent for epoxy resin and process for production thereof
  • Microcapsule-type latent curing agent for epoxy resin and process for production thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～3

[0108] Cooperate with 33g microcapsule latent curing agent 1, 2 or 3, and 67g bisphenol F type epoxy resin (epoxy equivalent is 160g / eq, hydrolyzed chlorine content is 0.007% by weight), obtains one of embodiment 1~3 Liquid epoxy resin composition.

Embodiment 4

[0110] 33 g of microcapsule latent curing agent 4 and 67 g of bisphenol A epoxy resin (epoxy equivalent: 173 g / eq, hydrolyzed chlorine content: 0.01% by weight) were mixed to obtain a one-component epoxy resin composition.

Embodiment 5

[0112] 45 g of microcapsule latent curing agent 3 and 55 g of bisphenol F epoxy resin (epoxy equivalent: 160 g / eq, hydrolyzed chlorine content: 0.007% by weight) were mixed to obtain a one-component epoxy resin composition.

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Abstract

Disclosed is a microcapsule-type latent curing agent for epoxy resin and a process for production thereof. The process for production of the microcapsule-type latent curing agent for epoxy resin comprises: reacting an amine adduct, an isocyanat in the core with a compound having an active hydrogen group and / or water in a dispersion medium, so as to form a capsule for covering the core; and taking the powder microcapsule-type latent curing agent with the core and the capsule out from the reaction mixture.

Description

[0001] The application date of the original application is September 17, 2008, the application number is 200880107917.4, and the title of the invention is "microcapsule latent curing agent for epoxy resin and its manufacturing method, and one-liquid epoxy resin composition A divisional application of the Chinese patent application and its cured product. technical field [0002] The present invention relates to a microcapsule-type latent curing agent for epoxy resin, a manufacturing method thereof, a one-liquid epoxy resin composition, and a cured epoxy resin. Background technique [0003] For epoxy resin, because its cured product has excellent performance in terms of mechanical properties, electrical properties, thermal properties, chemical resistance, adhesiveness, etc., it has been used in coatings, electrical and electronic insulating materials, bonding, etc. Agents and other wide-ranging uses. Most of the currently used epoxy resin compositions are so-called two-compon...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/50C08L63/00
CPCC08G59/184C08G59/50C08L63/00B01J13/02C08G59/40C08K9/10
Inventor 舟生重昭冈田穰森下芳伊
Owner HITACHI CHEM CO LTD
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