A heat sink and a method of making a cooled device with a heat sink

Abstract

A heat sink (1) including a mounting structure, such as a mounting base, and adapted for being mounted in thermal contact with electronics equipment, said heat sink having a first end (A) and a second end (B) opposite said first end (A) and comprising: - a first heat transfer structure (30) comprising spaced apart first walls (35) mounted in thermal contact with said mounting structure, - said first walls (35) defining a plurality of major air flow passages (10) of said heat sink, said major air flow passages (10) extending between said first end (A) and said second end (B) and opening at said first end (A) and said second end (B), and - a plurality of second heat transfer structures (40) mounted in thermal contact with said first walls (35) and including spaced apart second walls (45) defining a plurality of minor flow passages (42) extending between said first end (A); and said second end (B), wherein at least some of said major air flow passages (10, 20) each including two or more of said second heat transfer structures (40) arranged in a spaced apart relationship, a plenum (4) between two adjacent second heat transfer structures (40) in a major air flow passage being defined in part by two opposite first walls (35) of said first heat transfer structure (30).

Description

technical field [0001] The invention relates to a heat sink comprising a mounting structure such as a base for being mounted in thermal contact with an electronic device, the heat sink has a first end and a second end opposite to the first end and includes a second A heat transfer structure, the first heat transfer structure includes spaced apart first walls mounted in thermal contact with the mounting structure; the first walls define a plurality of main The air flow channel, the main air flow channel extends between the first end and the second end and opens at the first end and the second end, and the heat sink further includes a plurality of second heat transfer structures, the second heat transfer structures pass through mounted in thermal contact with the first wall, the second heat transfer structure includes spaced apart second walls defining a plurality of Secondary runner. Background technique [0002] A heat sink as described above can be found in US Patent No. ...

AI Technical Summary

Problems solved by technology

The problem with this type of heat sink is that the secondary flow channels defined by the corrugated fins cause a high pressure drop, while any fan that drives air through the heat sink has a correspondingly high power draw

Making the secondary runner wider will reduce the pressure drop, but will also reduce the heat energy transferred

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