A Method for Saving Consumables in Lead Frame Structure

Abstract

The invention discloses a method for saving consumable materials of a lead frame structure. The method comprises the following steps that: an auxiliary plug structure is arranged; pins of a lead frame are set as a discrete bar-shaped structure; the lengths of the pins are slightly larger than the lengths of the pins after being cut down; the pins in the bar-shaped structure are inserted into the plug structure; a plurality of pins are inserted into one plug structure; the distance between the pins is just equal to the connection position relationship of the pins and the lead frame correspondingly; and when the pins are bonded with the lead frame by using the plug structure and are fixed together by using an auxiliary fixing method, the plug structure is withdrawn to the outer side so as to achieve the effect of being dissociated from the pins. By arranging the plug structure and setting the pins as the long bar-shaped structure, the function of installing and fixing the auxiliary pins on the plug structure are realized, the pins do not need to be cut down with large allowance and cutting belts do not need to be set up, so that a great quantity of consumable materials are saved, and the plug structure can be repeatedly used.

Description

technical field [0001] The invention relates to packaging equipment for semiconductor discrete devices, in particular to a method for saving consumables with a lead frame structure that saves consumables. Background technique [0002] The commonly used lead frame structure saves consumables. It has 3-4 cut sections, of which there are 2 in the part of the heat sink. The area of ​​the cutting surface in the middle is 3mm*3mm, so it often needs a large cutting force during the cutting process, and this also leads to the shock and vibration during the cutting process, which increases the ohmic contact of the chip. [0003] In response to this technical problem, Wuxi Yuqi Hongguang Electronics Co., Ltd. applied for a lead frame structure named "Easy Cutting" on August 31, 2011, and the application number is: 201120002290. The technical solution of this patent discloses the main structure of the lead frame structure, that is, the bottom pins thereof need to be cut off. Due to t...

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problem that the pins of the lead frame structure in the prior art need to be cut off, resulting in waste of materials, the present invention provides a method for saving consumables in the lead frame structure