Array substrate, manufacturing method thereof, and display device
An array substrate and substrate technology, which is applied in semiconductor/solid-state device manufacturing, diodes, semiconductor devices, etc., can solve the problems of complex manufacturing process and complex hierarchical structure of microcavity structure, and achieves simple manufacturing process, low cost, and increased transparency. Overrate effect
Active Publication Date: 2015-12-23
BOE TECH GRP CO LTD
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[0005] Depend on figure 2 and image 3 It can be seen that although the existing microcavity structure increases the light transmittance, the hierarchical structure of the existing microcavity structure is relatively complicated, and the corresponding regions of the filters of each color are made of microcavity structures with different thicknesses. , the production process is more complex
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[0062] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.
[0063] Such as Figure 5 As shown, the array substrate of this embodiment includes: a plurality of gate lines and data lines formed on the substrate 1 , and pixel units formed by intersections of the gate lines and the data lines. The pixel unit includes: a thin film transistor structure formed on the substrate and an organic light emitting diode driven by the thin film transistor structure. The organic light emitting diode is located in the pixel area of the pixel unit (usually refers to the display area other than the thin film transistor), namely Figure 5 Middle A area (areas other than area A are TFT areas). The pixel unit also includes a color filter 9 . The org...
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The invention discloses an array substrate, which comprises a plurality of pixel units located on the substrate. The pixel units include: a thin film transistor structure formed on the substrate; and an organic light emitting diode driven by the thin film transistor structure. The organic light emitting diode is located on the pixel unit. In the pixel area, the organic light-emitting diode includes a transparent first electrode, a light-emitting layer, and a second electrode that reflects light in sequence in a direction away from the substrate; a semi-reflective and semi-transparent layer is located between the organic light-emitting diode and the thin film transistor structure; the color filter, It is located between the second electrode of the organic light-emitting diode and the semi-reflective layer; the second electrode of the organic light-emitting diode and the semi-reflective layer form a microcavity structure. Also disclosed are a manufacturing method of the above-mentioned array substrate and a display device comprising the above-mentioned array substrate. The invention realizes the structure on the array substrate, and the microcavity structure with simple manufacturing process.
Description
technical field [0001] The present invention relates to the field of display technology, in particular to an array substrate, a manufacturing method thereof, and a display device. Background technique [0002] Organic light-emitting diodes (Organic Light-Emitting Diodes, OLED) are considered to be one of the most important display technologies in the future due to their advantages such as simple preparation process, low cost, adjustable emission color in the visible light region, and easy large-area and flexible bending. In particular, the power efficiency of white light OLED (WOLED) has exceeded 60lm / W, and the life span has reached more than 20,000 hours, which has greatly promoted the development of WOLED. [0003] Such as figure 1 As shown in (a), one of the WOLEDs is doped into an organic light-emitting layer 102 with red, green and blue primary colors, so that the organic light-emitting layer 102 emits white light. The organic light-emitting layer 102 is located betwe...
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IPC IPC(8): H01L27/12H01L27/32H01L21/77
CPCH10K59/38H10K59/124H10K50/852H10K50/856H10K59/1201H10K59/131H10K71/00H10K59/12
Inventor 宋泳锡刘圣烈崔承镇金熙哲
Owner BOE TECH GRP CO LTD