Sensor part for infrared sensor and manufacturing method thereof

Abstract

The invention relates to a sensor unit for an infrared sensor comprising an IR-sensitive detector (1), at least one reference source (2) radiating an IR beam, and an IR-sensitive reference detector (3), which At a certain distance from the detector (1) in the direction of the incident IR beam, wherein the at least one reference source (2) is arranged on the side of the reference detector (3) and also includes a carrier (5) on which A detector (1), at least one reference source (2) and a reference detector (3) are arranged on a first side (6), wherein the carrier (5) comprises a blank made of flexible material bent in local sections Parts, in particular a partially curved blank comprising a flexible printed circuit board. The invention thus achieves the object of providing a three-dimensional sensor component for an IR sensor which can be produced in a simple manner. Furthermore, the invention relates to a method for producing the sensor component and to an IR sensor.

Description

technical field [0001] The invention relates to a sensor component comprising an IR-sensitive detector, at least one reference source radiating IR radiation, and an IR-sensitive reference detector. Furthermore, the invention relates to an IR sensor according to claim 12 and a method for producing a sensor component according to claim 13 . Background technique [0002] Three-dimensionally structured sensor components for IR sensors are known from the prior art, which are formed, for example, on a semiconductor substrate as carrier for detector, reference detector and reference source. The production of such sensor components is expensive, especially when mass production is involved. [0003] Although three-dimensional electronic components can be produced using MID (Molded Interconnect Device) technology, for example, by hot stamping, laser structuring, using masks or back-sprayed films, the sensor components for IR sensors are due to Only small dimensions (a few millimeter...

AI Technical Summary

Problems solved by technology

[0003] Although three-dimensional electronic components can be produced using MID (Molded Interconnect Device) technology, for example, by hot stamping, laser structuring, using masks or back-sprayed films, the sensor components for IR sensors are due to Only small size (a few millimeters in total for the sensor part, maybe less than 1mm for the detector or reference source), so not reliable in the case of manufacturing large part quantities

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