Amplitude-calibrated packaged sandwich antenna with embedded plated though holes

Abstract

The invention relates to a horn antenna, in particular to an amplitude-calibrated packaged sandwich antenna with embedded plated though holes. The antenna comprises a microstrip feeder (1), a horn antenna (2) and plated through holes (3), wherein the microstrip feeder (1), the horn antenna (2) and the plated through holes (3) are integrated on a dielectric substrate (4). The dielectric substrate (4) is inside three-dimensional package (5). One end of the microstrip feeder (1) is connected with an internal circuit (8) through a coplanar waveguide (7) on the side of the package. The horn antenna (2) comprises a bottom metal plane (9), a top metal plane (10) and plated through hole sidewalls (11). The plated through holes (3) form a middle plated through hole array (16), a left plated through hole array (17) and a right plated through hole array (18). Four dielectric loaded waveguides are formed in the horn antenna (2). One end of each dielectric loaded waveguide faces to the microstrip feeder (1), and the other end of each dielectric loaded waveguide is close to an antenna aperture plane (12). Aperture efficiency of the amplitude-calibrated packaged sandwich antenna with embedded plated though holes can be improved.

Description

technical field [0001] The invention relates to a horn antenna, in particular to a package sandwich antenna embedded with metallized via holes for amplitude calibration. Background technique [0002] Using stacked three-dimensional multi-chip (3D-MCM) technology, a radio frequency system can be integrated in a three-dimensional stacked package, for which it is also necessary to integrate the antenna on the package. Usually, the antenna is integrated on the surface of the package, for example, the patch antenna is integrated on the top of the package. But sometimes it is necessary to integrate the antenna in an interlayer in the middle of the package to meet the needs of the system. The above requirements can be achieved if the horn antenna is integrated in the interlayer inside the package. However, horn antennas are usually non-planar, incompatible with planar circuit technology, and have large geometric dimensions, which limits their application in packaging structures. ...

AI Technical Summary

Problems solved by technology

However, the horn antenna is usually non-planar, incompatible with the planar circuit process, and has a large geometric size, which limits its application in the packaging structure

In recent years, the substrate-integrated waveguide horn antenna developed based on substrate-integrated waveguide technology has the characteristics of small size, light weight, and easy planar integration. However, the gain of the traditional substrate-integrated waveguide horn antenna is relatively low. One of the reasons is that the aperture The amplitude of the electromagnetic field on the surface is very uneven, the middle is large and the two sides are small, which affects the radiation performance of the antenna

At present, methods such as dielectric loading and dielectric prisms have been used to correct the asynchronous phase of the horn's aperture surface, but these methods cannot improve the uniformity of the electromagnetic field amplitude distribution on the aperture surface, and these phase alignment structures increase the overall structural size of the antenna. Not suitable for integration into package internal mezzanine

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