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Integrated circuit plate control device capable of removing automatically

An integrated circuit board, automatic disassembly technology, applied in electric heating devices, manufacturing tools, metal processing and other directions, can solve problems such as low efficiency and high work intensity

Inactive Publication Date: 2013-04-10
SHANGHAI GONGLIAN COMM INFORMATION DEV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] As the amount of maintenance increases, more and more large-scale integrated circuits need to be disassembled. The efficiency of using the BGA soldering station mode is too low, and the manual operation method is used for a long time, and the work intensity is too high. It is required to adopt a method between the two. time-based approach, adapting to existing scale

Method used

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  • Integrated circuit plate control device capable of removing automatically

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Experimental program
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Effect test

Embodiment

[0016] Such as figure 1 As shown, an integrated circuit board automatic disassembly control device includes a housing, a controller 1, a heating mechanism 2 and a shelf platform 3 for an integrated circuit board to be removed, and the heating mechanism 2 and the shelf platform 3 for an integrated circuit board to be removed are both Located in the casing, the heating mechanism 2 is aimed at the integrated circuit board to be disassembled, and the controller 1 is respectively connected with the heating mechanism 2 and the shelving platform 3 for the integrated circuit board to be removed.

[0017] The integrated circuit board resting platform 3 to be disassembled is movably connected with the housing. The heating mechanism 2 includes a heater 23, a fan 22 and a rotating unit 21, the heater 23 is arranged at the air outlet of the fan 22, the rotating unit 21 is connected to the fan 22, and the rotating unit 21 is connected to the fan 22. The controller 1 is connected; the contr...

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PUM

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Abstract

The invention relates to an integrated circuit plate control device capable of removing automatically. The integrated circuit plate control device capable of removing automatically comprises a shell, a controller, a heating mechanism and a ready-to-remove integrated circuit plate lay-up platform. The heating mechanism and the ready-to-remove integrated circuit plate lay-up platform are both arranged inside the shell, the heating mechanism is directed at the ready-to-remove integrated circuit plate, and the controller is respectively connected with the heating mechanism and the integrated circuit plate lay-up platform. Compared with the prior art, the integrated circuit plate control device capable of removing automatically has the advantages of accelerating removing speed, improving maintainability of a maintenance department and the like.

Description

technical field [0001] The invention relates to an integrated circuit board disassembly related technology, in particular to an integrated circuit board automatic disassembly control device. Background technique [0002] At present, BGA soldering stations are used to disassemble large-scale integrated circuits at home and abroad, and it takes a lot of time to dismantle one piece, and manual operation is also performed using a hand-held heat gun. [0003] As the amount of maintenance increases, more and more large-scale integrated circuits need to be disassembled. The efficiency of using the BGA soldering station mode is too low, and the manual operation method is used for a long time, and the work intensity is too high. It is required to adopt a method between the two. In a spatial manner, adapt to the existing scale. Contents of the invention [0004] The object of the present invention is to provide an integrated circuit board automatic disassembly control device in ord...

Claims

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Application Information

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IPC IPC(8): B23K3/00B23K3/04B23K1/018
Inventor 姚卫元
Owner SHANGHAI GONGLIAN COMM INFORMATION DEV