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Photosensitive resin composition, cured film thereof and printed circuit board

A technology of photosensitive resin and composition, which is applied in the direction of printed circuit, printed circuit manufacturing, printed circuit parts, etc., can solve the problems of poor water resistance, cured product expansion, peeling, etc., and achieve high resistance to chemical tin plating, finger touch good drying effect

Active Publication Date: 2013-04-10
TAIYO HLDG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When using such a resin with a relatively high acid value, the water resistance is poor, and the plating solution penetrates into the cured product of the solder resist during electroless gold plating, which may cause problems such as swelling and peeling of the cured product

Method used

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  • Photosensitive resin composition, cured film thereof and printed circuit board
  • Photosensitive resin composition, cured film thereof and printed circuit board
  • Photosensitive resin composition, cured film thereof and printed circuit board

Examples

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Embodiment

[0183] Although an Example and a comparative example are shown below and this invention is demonstrated concretely, this invention is not limited to a following example. In addition, "part" and "%" described below refer to a mass basis unless otherwise specified.

[0184] (1) Synthesis of non-photosensitive carboxylic acid resin B1 (acid value: 160)

[0185] 377 g of dipropylene glycol monomethyl ether was added to a 2000 ml flask equipped with a stirrer and a cooling tube, and it heated to 90 degreeC under nitrogen flow.

[0186] 104.2 g of styrene, 246.5 g of methacrylic acid, dimethyl 2,2'-azobis (2-methylpropionate) (dimethyl2,2'-azobis(dimethyl2,2'-azobis( 2-methylpropionate)) (manufactured by Wako Pure Chemical Industries, Ltd.: V-601) 20.7 g of the mixed solution.

[0187] In this way, non-photosensitive carboxylic acid resin B1 was obtained. The solid content acid value of this B1 was 160 mgKOH / g, and the solid content was 50%.

[0188] (2) Synthesis of non-photose...

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Abstract

The present invention provides a photosensitive resin composition having good dryness to touch and excellent resistance to electroless gold plating; a cured film thereof; and a printed circuit board comprising the cured film. [Means for Solution] The photosensitive resin composition is characterized by comprising (A) an acid-modified photosensitive epoxy resin, (B) a non-photosensitive carboxylic acid resin and (C) a liquid bifunctional epoxy resin. It is preferred that the above-described (B) non-photosensitive carboxylic acid resin have a weight-average molecular weight of 10,000 to 30,000.

Description

technical field [0001] The present invention relates to a photosensitive resin composition, its cured film, and a printed circuit board having the cured film, and more specifically, to a photosensitive resin composition having good dryness to the touch, high resistance to chemical gold plating, and high resistance to chemical tin plating material, its cured film and a printed circuit board with the cured film. Background technique [0002] In recent years, solder resists for consumer printed circuit boards and industrial printed circuit boards have used at least one of heat and light irradiation to form an image by developing after ultraviolet irradiation from the viewpoint of high precision and high density. Liquid developable solder resist that undergoes final curing (main curing). In addition, in response to the increase in density of printed circuit boards accompanying the reduction in size and weight of electronic equipment, improvements in handling and performance of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004H05K1/02
CPCC08L63/00H05K3/287G03F7/038C08L31/00C08K3/28C08K3/34C08L33/02G03F7/033
Inventor 乘越明男有马圣夫
Owner TAIYO HLDG CO LTD