Silicon wafer automatic feeding and discharging device for plasma enhanced chemical vapor deposition (PECVD) device

A technology for automatic loading and unloading of silicon wafers, applied in the direction of transportation and packaging, conveyor objects, etc., can solve the problems of low production efficiency of manual operation, production cost of silicon wafer crushing, high labor intensity, etc., to avoid high silicon wafer breakage rate , Reduce the labor intensity of workers and improve production efficiency

Active Publication Date: 2013-04-10
WUXI LEAD INTELLIGENT EQUIP CO LTD
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  • Application Information

AI Technical Summary

Problems solved by technology

At present, the above-mentioned transfer of silicon wafers needs to be done manually. The disadvantage is that manual handling can easily cause s

Method used

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  • Silicon wafer automatic feeding and discharging device for plasma enhanced chemical vapor deposition (PECVD) device
  • Silicon wafer automatic feeding and discharging device for plasma enhanced chemical vapor deposition (PECVD) device
  • Silicon wafer automatic feeding and discharging device for plasma enhanced chemical vapor deposition (PECVD) device

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Embodiment Construction

[0030] The present invention will be further described below in conjunction with specific examples.

[0031] As shown in the figure, the silicon wafer automatic loading and unloading device for PECVD equipment is equipped with a manipulator 10 rotating on the frame, a suction cup 11 is installed on the manipulator 10, and a first silicon wafer is installed on the frame outside the manipulator 10. Cassette conveying mechanism 1a, first lifting platform mechanism 2a, guiding mechanism 3, first film delivery mechanism 4a, first storage mechanism 5a, first transportation mechanism 6a, first trolley positioning mechanism 7a, first graphite boat positioning Mechanism 8a and the first conveying trolley 9a are equipped with the second silicon wafer cassette conveying mechanism 1b, the second elevating platform mechanism 2b, the sheet conveying mechanism 12, the second sheet discharging conveying mechanism 4b, the second storage material mechanism 5b, the second transport mechanism 6b,...

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Abstract

The invention relates to a silicon wafer automatic feeding and discharging device for a plasma enhanced chemical vapor deposition (PECVD) device. A mechanical arm is installed on a rack in a rotating mode, and an adhesive disc is installed on the mechanical arm. A first silicon box transmission mechanism, a first lifting platform mechanism, a guide mechanism, a first out slice transporting mechanism, a first musical storing mechanism, a first transporting mechanism, a first trolley positioning mechanism, a first graphite boat positioning mechanism and a first transporting trolley are installed on the rack which is arranged at the outer side of the mechanical arm. A second silicon box transmission mechanism, a second lifting platform mechanism, an out slice transporting mechanism, a second out slice transporting mechanism, a second musical storing mechanism, a second transporting mechanism, a second trolley positioning mechanism, a second graphite boat positioning mechanism and a second transporting trolley are installed at the inner side of the rack. The silicon wafer automatic feeding and discharging device for the PECVD device has the advantages of greatly improving production efficiency, reducing labor intensity of workers, preventing the problem of high silicon damage rate caused by manual feeding and discharging from happening and decreasing manufacturing cost.

Description

technical field [0001] The invention relates to the field of solar silicon wafer processing automation equipment, in particular to an automatic silicon wafer loading and unloading device for PECVD equipment. Background technique [0002] In the existing silicon wafer anti-reflection film preparation process, the silicon wafers in the carrier box that have not been treated by PECVD need to be loaded into the graphite boat, and the silicon wafers in the graphite boat that have been treated by PECVD are loaded into the carrier box. At present, the above-mentioned transfer of silicon wafers needs to be done manually. The disadvantage is that manual handling can easily cause silicon wafers to break and increase production costs. At the same time, manual operations have low production efficiency and high labor intensity. Contents of the invention [0003] The purpose of the present invention is to overcome the deficiencies in the prior art, and provide a silicon wafer automatic ...

Claims

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Application Information

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IPC IPC(8): H01L21/677
Inventor 王燕清周昕
Owner WUXI LEAD INTELLIGENT EQUIP CO LTD
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