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Method and apparatus for de-embedding

A technology for testing structures and signal transmission lines, which is applied to measuring devices, instruments, electrical components, etc., and can solve problems that cannot fully meet the requirements

Active Publication Date: 2013-04-17
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Thus, while existing de-embedding methods are generally adequate for their intended purposes, they are not fully satisfactory in every respect

Method used

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  • Method and apparatus for de-embedding
  • Method and apparatus for de-embedding
  • Method and apparatus for de-embedding

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Embodiment Construction

[0044] It should be understood that the following disclosure provides many different embodiments, or examples, for implementing various features of the invention. Specific examples of components and configurations are described below to simplify the present disclosure. Of course, these are merely examples and not intended to be limiting. Furthermore, the following description of a first component being formed over a second component may include embodiments where the first and second components are formed in direct contact, and may also include that additional components may be formed sandwiched between the first and second components. An embodiment such that the first and second parts are not in direct contact. Various features are arbitrarily drawn in different scales for simplicity and clarity.

[0045] figure 1 A flow chart of a method 11 of de-embedding according to various aspects of the present disclosure is shown. refer to figure 1 , the method 11 begins at block 1...

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Abstract

De-embedding apparatus and methods of de-embedding are disclosed. A de-embedding apparatus includes a test structure including a device-under-test (DUT) embedded in the test structure, and a plurality of dummy test structures including an open dummy structure, a distributed open dummy structure, and a short dummy structure. The distributed open dummy structure may include a first signal transmission line coupled to a left signal test pad and a second signal transmission line coupled to a right signal test pad, the first and second signal transmission lines having a smaller total length than a total length of signal transmission lines of the open dummy structure, and intrinsic transmission characteristics of the DUT can be derived from transmission parameters of the dummy test structures and the test structure

Description

technical field [0001] The present disclosure relates generally to semiconductor devices, and more particularly, to methods and apparatus for de-embedding. Background technique [0002] An integrated circuit (IC) formed on a semiconductor substrate includes a plurality of active and passive devices such as resistors, inductors, capacitors, transistors, amplifiers, and the like. Such components are manufactured to design specifications that define the desired physical / electrical properties (eg, resistance, inductance, capacitance, gain, etc.) that the component will exhibit. While it is desirable to verify that each component manufactured complies with its characteristic design specifications, typically the corresponding component cannot be easily inspected after integration into a circuit. Therefore, "independent" replicas of each IC component are fabricated on a wafer, fabricated using the same process and utilizing the same physical / electrical characteristics as the IC co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/544H01L21/66
CPCH01L22/34H01L2924/0002Y10T29/49004H01L2924/00G01R31/26G01R31/3187G01R31/282
Inventor 卓秀英
Owner TAIWAN SEMICON MFG CO LTD
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