Shape memory alloy driven thermal switch

Abstract

The invention relates to a shape memory alloy driven thermal switch which comprises a heat conduction cylinder, a central support, a heat insulation cylinder and a heat conduction belt. The central support is arranged in the heat conduction cylinder, the heat conduction belt is arranged on the heat conduction cylinder and fixed on the upper portion of the central support, the heat insulation cylinder is arranged at an inner edge of the upper end of the heat conduction cylinder, and a bottom cover is arranged at the bottom of the heat conduction cylinder. The central support is of a boss-shaped hollow structure, a polarization spring is arranged in a cavity of the central support, a lower section boss of the central support is in clearance fit with the cavity of the bottom cover, and a shape memory alloy spring is sleeved at the periphery of the central support. The shape memory alloy driven thermal switch uses memory effects of shape memory alloy to integrate temperature sensing and driving functions and efficiently and rapidly achieve automatic control on heat flux, and the shape memory alloy driven thermal switch is good in adiabaticity during breaking, good in thermal conductivity after closing and capable of replacing a traditional temperature control device to be used in a special occasion and has advantages of being big in deflection, big in freedom degree of the deformation direction, capable of sharply deforming along changes of the temperature, high in power weight ratio and the like.

Description

technical field [0001] The invention relates to a temperature control device, in particular to a thermal switch driven by a shape memory alloy with good heat conduction performance after closing and good heat insulation performance after disconnection. Background technique [0002] A thermal switch is a heat transfer element that achieves active thermal control by controlling the thermal resistance of the heat conduction path. So far, thermal switch technology has been greatly developed, and a variety of thermal switches based on different principles have been used in practical applications, including bimetallic strip driven thermal switches, micro thermal expansion thermal switches, paraffin driven thermal switches, air gap type Thermal switch and memory alloy thermal switch. These traditional thermal switches have many inherent disadvantages, such as the bimetal thermal switch, which has a relatively complex structure, and the limited driving force of the bimetal leads to...

AI Technical Summary

Problems solved by technology

These traditional thermal switches have many inherent disadvantages, such as the bimetal thermal switch, which has a relatively complex structure, and the limited driving force of the bimetal leads to a large contact thermal resistance; It is very high, requires high sealing of the device, and has a relatively complicated structure; if the micro-expansion low-temperature thermal switch is used in a long-term closed situation, cold welding may occur, resulting in failure to open when it needs to be disconnected

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