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Device and method for measuring surface roughness parameters

A technology for surface roughness and parameter measurement, which is applied in the field of surveying and mapping, can solve problems such as difficulty in ensuring the levelness of horizontal beams, expensive laser profilers, and time-consuming installation operations, and achieve good measurement accuracy, simple structure, and simplified installation operations. Effect

Inactive Publication Date: 2016-05-04
CENT FOR EARTH OBSERVATION & DIGITAL EARTH CHINESE ACADEMY OF SCI
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  • Claims
  • Application Information

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Problems solved by technology

[0004] The surface roughness parameter measurement device in the prior art has the following defects: the laser profiler is expensive and the installation process is time-consuming and laborious, which seriously affects the measurement efficiency; on the other hand, when the surface is covered by a small amount of vegetation, the laser head emits The light beam will be directly reflected back by these vegetation, resulting in the measured value is not the distance to the surface, and the error is large
Compared with the laser profiler, the probe instrument is cheaper and will not affect the accuracy of the measurement value due to the small amount of vegetation covered on the surface to be measured. However, the probes need to be inserted into the reserved holes one by one during the measurement. First, the installation operation is very time-consuming, which seriously affects the measurement efficiency. In addition, the two supports of the probe instrument in the prior art require the ground directly in contact with the supports to be level, otherwise, it is difficult to ensure the levelness of the horizontal beam, which also affects The accuracy of the measured surface roughness parameter values

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  • Device and method for measuring surface roughness parameters
  • Device and method for measuring surface roughness parameters
  • Device and method for measuring surface roughness parameters

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Embodiment Construction

[0021] This embodiment provides a device for measuring surface roughness parameters, please refer to figure 1 , figure 2 and Figure 4 , including: two columnar brackets 1 arranged vertically, the sides of the bottom ends of the brackets are wedge-shaped surfaces; horizontal upper crossbars 12 and lower crossbars 13 are respectively fixedly connected between the two brackets 1, and the upper crossbar 12 A plurality of upper through-holes 121 and lower through-holes 131 are correspondingly opened on the lower cross-bar 13 respectively, and a plurality of probes 2 are respectively vertically penetrated through the upper through-holes 121 on the upper cross-bar 12 and corresponding on the lower cross-bar 13 In the lower through hole 131; the gap fit between the probe 2 and the upper through hole 121 and between the probe 2 and the lower through hole 131; the top of the probe 2 is provided with a stopper for preventing the probe from slipping off from the upper through hole 21....

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Abstract

The invention provides a surface roughness parameter measurement device and a method using the surface roughness parameter measurement device. The surface roughness parameter measurement device comprises two vertically arranged column-shaped supports. A horizontal upper cross beam and a horizontal lower cross beam are fixedly connected between the two supports. An upper through hole and a lower through hole are respectively and correspondingly formed in the upper cross beam and the lower cross beam. A probe respectively and perpendicularly penetrates through the upper through hole and the corresponding lower through hole. The probe is respectively in clearance fit with the upper through hole and the lower through hole. The top end of the probe is provided with a stop head preventing the probe from slipping from the upper through hole. The lower end of the probe is provided with a top-abutting portion for being contacted with the ground surface. The surface roughness parameter measurement device is capable of improving measurement efficiency, being simple in structure, low in cost, adaptive to measurement of places covered with plants or places with uneven ground surfaces in contact with the supports and ensuring good measurement accuracy.

Description

technical field [0001] The invention relates to surveying and mapping technology, in particular to a device and method for measuring surface roughness parameters. Background technique [0002] The surface roughness is specifically characterized by two parameters, the root mean square height of the surface and the correlation length. parameters. [0003] Devices for measuring surface roughness parameters in the prior art include laser profilers and probe instruments. The laser profiler installs a laser head on a horizontal plate on the top of a fixed bracket. When measuring, first level the horizontal plate on the bracket, and then use the laser head to observe the distance from the horizontal plate to the ground vertically downwards, and convert the obtained value Finally, the surface roughness parameters are obtained; the probe instrument includes a support body and a thin rod-shaped probe, and the two ends of the support body are supports for placing on the ground. Ther...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01B11/30
Inventor 陈权李震曾江源
Owner CENT FOR EARTH OBSERVATION & DIGITAL EARTH CHINESE ACADEMY OF SCI