Light emitting diode (LED) chip and manufacturing method

Abstract

The invention discloses a light emitting diode (LED) chip which comprises step-shaped piling, a P-type electrode and an N-type electrode. A passivation layer is arranged above the piling. The P-type electrode is formed in the passivation layer and arranged in an area corresponding to a first step surface. The N-type electrode is formed in the passivation layer and arranged in an area corresponding to a second step surface, wherein the ratio of the area of the P-type electrode to that of the N-type electrode, or the ratio of the area of the N-type electrode to that of the P-type electrode is 0.7-1.2. The invention further discloses two improved LED chips and two manufacturing methods manufacturing the LED chips. The LED chip and the manufacturing method solve the problems that in the prior art, the LED chip is prone to producing dry joint, deviation, short circuit and the like in the application of SMT technology.

Description

technical field [0001] The invention relates to an LED chip, in particular to an LED chip suitable for surface mount technology. [0002] The present invention also relates to a method of manufacturing an LED chip. Background technique [0003] Light Emitting Diode (LED) is a new type of light source. Compared with traditional light sources, it has many advantages: longevity, energy saving, low voltage, small size and environmental protection. [0004] The traditional LED chip packaging process steps are as follows: first, the LED chip is fixed in the bracket through the interface thermal conductive material, that is, the die-bonding process, at this time, the metal electrode of the LED chip faces upward; second, it is realized by the gold wire bonding process. The chip electrode is connected to the external circuit, and then the LED chip is packaged with a highly transparent resin to protect the light-emitting device and the package structure. [0005] The traditional LED...

AI Technical Summary

Problems solved by technology

[0005] The traditional LED chip packaging process mainly has the following three shortcomings: low heat transfer efficiency of the chip, high complexity of multi-chip assembly, and low packaging efficiency

Therefore, based on the light-emitting principle of the LED, it will inevitably lead to a large difference in the area of ​​the two poles and a limitation in the area of ​​the insulating layer.

The large difference in the area of ​​the two poles and the small area of ​​the insulating layer make the LED chips in the prior art unsuitable for SMT mounting

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