Unlock instant, AI-driven research and patent intelligence for your innovation.

Manufacturing method of FPC (Flexible Printed Circuit) product containing BGA (Ball Grid Array) structure and circuit board

A manufacturing method and circuit board technology, which is applied in circuit lamination, printed circuit, printed circuit manufacturing, etc., can solve the problems of large FPC pad opening, offset virtual soldering, and low precision, so as to solve the problem of offset virtual soldering , to avoid the effect of pad offset

Pending Publication Date: 2021-07-20
LEADER TECH ELECTRONICS SHENZHEN INC
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the above-mentioned BGA structure FPC pads with large windows and low precision; pads are prone to misalignment, which directly leads to poor technical problems such as patching of SMT products, misalignment and virtual soldering, etc., the present invention provides a BGA structure. The production method of FPC products, and specifically provide the following technical solutions:

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Manufacturing method of FPC (Flexible Printed Circuit) product containing BGA (Ball Grid Array) structure and circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] Such as figure 1 Shown, a kind of FPC product manufacturing method that contains BGA structure specifically comprises the following steps:

[0041] S1: Use a cutting machine to cut the raw material cover film into a size suitable for the FPC to be processed, and drill holes and open windows on the cut cover film. Among them, the cover film material is polyimide material, the raw material cover film is roll material, the width is 250 or 500mm, and the thickness is 27.5um, 32.5um or 37.5um.

[0042] S2: Utilize the FPC raw material to make the FPC semi-finished product to be processed containing the BGA pad structure.

[0043] S3: Pressing the cover film and the FPC semi-finished product to be processed.

[0044] S4: Use a laser drilling machine to open a window with a laser on the FPC semi-finished product to be processed that has been laminated with a cover film according to the processing shape of the FPC semi-finished product to be processed, and punch through the c...

Embodiment 2

[0048] As a further improvement of the first embodiment above, the above step S2 specifically includes the following process:

[0049] 1. Cut the material, use the cutting machine to cut the whole roll or large-area FPC raw material into the size required for design and processing. Among them, the working parameters of the cutting machine are: air pressure 0.4-0.6mpa / cm2, speed 50-99Hz.

[0050] 2. Drilling, use the drilling machine to process the identification holes, assembly holes, second positioning holes and conduction holes on the product on the basis of the cut FPC principle. Among them, the working parameters of the drilling machine are: pressure foot 0.25-0.3MPa, main air pressure 0.68±0.1MPa, speed: 30-100kr / min; feed speed: 0.8-2.0m / min; knife return speed 8-20m / min min.

[0051] 3. Copper plating, the drilled FPC raw material is electroplated in a copper sulfate solution, so that the copper ions precipitated in the copper sulfate solution are attached to the surfa...

Embodiment 3

[0058] As a further improvement of the second embodiment above, the above step S1 specifically includes the following process:

[0059] 1. Use a cutting machine to cut the raw material cover film into a size suitable for the FPC to be processed.

[0060] 2. Use a drilling machine to drill holes in the cut cover film, including processing the first positioning hole. Among them, the working parameters of the drilling machine are: pressure foot 0.25-0.3MPa, main air pressure 0.68±0.1MPa, speed: 30-100kr / min; feed speed: 0.8-2.0m / min; knife return speed 8-20m / min min.

[0061] 3. Use the punch press to install the mold corresponding to the FPC to be processed to punch the cover film and open the window. Among them, the working main pressure gauge of the punch press is 0.4-0.7mpa / cm 2 .

[0062] In another embodiment, the above step S1 uses a die-cutting line to install a mold corresponding to the FPC to be processed, and performs punching, window opening and hole opening on th...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a manufacturing method of an FPC (Flexible Printed Circuit) product containing a BGA (Ball Grid Array) structure and a circuit board. The manufacturing method of the FPC product containing the BGA structure comprises the following steps: manufacturing a cover film with a corresponding size according to the size of a to-be-processed FPC; manufacturing a to-be-processed FPC semi-finished product containing a BGA bonding pad structure; the cover film and the FPC semi-finished product to be processed being subjected to press fit; performing laser windowing on the to-be-processed FPC semi-finished product on which the cover film is laminated, and punching through the cover film on the BGA bonding pad; and cleaning the to-be-processed FPC semi-finished product after laser processing, and obtaining a finished FPC product with the BGA structure. By the adoption of the technical scheme, BGA bonding pad windowing is carried out on the FPC product through the laser technology, the minimum windowing of 0.05 mm can be achieved through a laser machine, and the alignment precision reaches 0.025 mm; and the alignment precision is improved while the windowing of the bonding pad is reduced. The problem of pad deviation is avoided, and the technical problems of deviation and insufficient soldering are solved.

Description

technical field [0001] The invention relates to the technical field of flexible circuit board production, and more specifically, to a method for manufacturing an FPC product containing a BGA structure and a circuit board. Background technique [0002] In the field of circuit board production, with the advancement of integration technology, equipment improvement and the use of deep submicron technology, the integration level of silicon single chips has been continuously improved, and the requirements for integrated circuit packaging have become more stringent. The number of pins has increased sharply, and power consumption has also increased. increase. In order to meet the needs of development, on the basis of the original packaging varieties, a new variety has been added to the market-ball grid array packaging, referred to as BGA (Ball Grid Array). [0003] At present, the production process of BGA structure FPC products is similar to the production process of QFP (QFP is t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/34H05K3/36
CPCH05K3/361H05K3/3447H05K2203/06
Inventor 苏华杰高军成李晓华
Owner LEADER TECH ELECTRONICS SHENZHEN INC
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com