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PCB D-shaped special-shaped pad processing method

A processing method and pad technology, applied in the direction of electrical components, printed circuit manufacturing, printed circuits, etc., can solve the problems of pad offset, test failure, size reduction, etc., to avoid pad offset, improve test efficiency, The effect of eliminating the problem of defect leakage

Active Publication Date: 2018-11-16
HUIZHOU KING BROTHER CIRCUIT TECH +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Conventional process technology and design cannot meet the production requirements of such products, which will lead to problems such as pad deviation, size reduction, poor solderability, and test failure.

Method used

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  • PCB D-shaped special-shaped pad processing method

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] A method for processing PCB "D"-shaped special-shaped pads, characterized in that it includes the following processes:

[0026] S1. According to the data of engineering design, the material is cut, and the lamination needs to make the first board to adjust the expansion and contraction before production;

[0027] S2. Set the single side of the film of the "D" shaped special-shaped pad circuit to 75 μm, and set the single side of the solder mask window to 60 μm;

[0028] S3. The outer circuit adopts LDI laser direct imaging alignment exposure to ensure the size of the circuit pad;

[0029] S4. The same LDI laser is used for direct imaging exposure of the solder resist to ensure that the solder resist window is as large as the circuit pad, and the deviation is minimized.

[0030] Further, it also includes the flying probe testing process, specifically: select a high-precision flying probe testing machine with a screw movement system before the test, and use the system so...

Embodiment 2

[0043] A method for processing PCB "D"-shaped special-shaped pads, characterized in that it includes the following processes:

[0044] S1. According to the data of engineering design, the material is cut, and the lamination needs to make the first board to adjust the expansion and contraction before production;

[0045] S2. Set the single side of the film of the "D" shaped special-shaped pad circuit to 50 μm, and the single side of the solder mask window to 50 μm;

[0046] S3. The outer circuit adopts LDI laser direct imaging alignment exposure to ensure the size of the circuit pad;

[0047] S4. The same LDI laser is used for direct imaging exposure of the solder resist to ensure that the solder resist window is as large as the circuit pad, and the deviation is minimized.

[0048] Further, it also includes the flying probe testing process, specifically: select a high-precision flying probe testing machine with a screw movement system before the test, and use the system softwa...

Embodiment 3

[0052] A method for processing PCB "D"-shaped special-shaped pads, characterized in that it includes the following processes:

[0053] S1. According to the data of engineering design, the material is cut, and the lamination needs to make the first board to adjust the expansion and contraction before production;

[0054] S2. Set the single side of the film of the "D" shaped special-shaped pad circuit to 100 μm, and set the single side of the solder mask window to 75 μm;

[0055] S3. The outer circuit adopts LDI laser direct imaging alignment exposure to ensure the size of the circuit pad;

[0056] S4. The same LDI laser is used for direct imaging exposure of the solder resist to ensure that the solder resist window is as large as the circuit pad, and the deviation is minimized.

[0057] Further, it also includes the flying probe testing process, specifically: select a high-precision flying probe testing machine with a screw movement system before the test, and use the system s...

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Abstract

The invention provides a PCB D-shaped special-shaped pad processing method. The method is characterized by comprising the following steps: S1, cutting is carried out according to data of engineering design, a first board needs to be manufactured for lamination, and after expansion is adjusted, production is carried out; S2, the single edge of a film of the D-shaped special-shaped pad line is set to be 50 to 100 mum, and the single edge of a resistance welding window is set to be 50 to 75 mum; S3, an outer-layer line adopts LDI laser for direct imaging contraposition exposure, and the size of the line pad is ensured; and S4, resistance welding adopts the same LDI laser for direct imaging exposure, the resistance welding window and the line pad are ensured to have the same size, and deviation is controlled to be minimum. A brand-new process flow and a D-shaped special-shaped pad processing precision control scheme are designed, a new electric measurement process detection technology is developed, the size and the electric performance of the D-shaped special-shaped pad can meet quality requirements of a customer, and a technical support is provided for large-scale automatic and rapidproduction of PCB D-shaped special-shaped pads for an enterprise.

Description

technical field [0001] The invention belongs to the technical field of PCB processing, and in particular relates to a processing method for a PCB "D"-shaped special-shaped pad. Background technique [0002] Radial inductors, capacitors, resistors and other PCB surface mount components with the characteristics of miniaturization, high quality, high energy storage and low resistance are more and more widely used in the fields of modern communications, high-end optoelectronics, and smart devices. The PCB pad of this type of component is basically the same size as the size of the solder mask opening, and the pad design can save more space. Because there is no solder resistance window groove around the pad to block tin, the stencil and the pad can be on the same level, so that the component pins have more uniform tinning performance, better electrical contact performance and heat dissipation performance. [0003] The conventional PCB pads are round or square, and there are 25-...

Claims

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Application Information

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IPC IPC(8): H05K3/34
CPCH05K3/341
Inventor 聂兴陪刘敏樊廷慧林映生吴世亮
Owner HUIZHOU KING BROTHER CIRCUIT TECH