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A lead-free solder with high service life

A lead-free solder, life-span technology, used in welding/cutting media/materials, welding media, metal processing equipment, etc., can solve problems such as lack of service life of solder, improve service life, increase memory characteristics, and reduce internal The effect of crack growth

Inactive Publication Date: 2015-08-19
XUZHOU NORMAL UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Lack of reports on the service life of solder

Method used

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  • A lead-free solder with high service life
  • A lead-free solder with high service life
  • A lead-free solder with high service life

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] The composition of lead-free solder with high service life is: 3.0% Ag, 0.5% Cu, 0.1% Fe, 0.05% nano-NiTi particles, and the balance is Sn.

[0017] The main performance test of solder: the solidus temperature is about 214°C, the liquidus temperature is about 217°C (considering the experimental error), and the service life is improved.

Embodiment 2

[0019] The composition of lead-free solder with high service life is: 3.8% Ag, 0.6% Cu, 0.01% Fe, 0.05% nano-NiTi particles, and the balance is Sn.

[0020] The main performance test of solder: the solidus temperature is about 213°C, the liquidus temperature is about 218°C (considering the experimental error), and the service life is improved.

Embodiment 3

[0022] The composition of lead-free solder with high service life is: 4.0% Ag, 1.5% Cu, 0.05% Fe, 0.1% nano-NiTi particles, and the balance is Sn.

[0023] The main performance test of solder: the solidus temperature is about 215°C, the liquidus temperature is about 218°C (considering the experimental error), and the service life is improved.

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Abstract

The invention discloses a lead-free solder with high service life and belongs to the field of electronic packaging braze welding materials. The lead-free solder with high service life is a novel lead-free solder which has higher service life in service time. Ingredients comprise, by mass, 0.01-1% of nanometer nickel titanium (NiTi) (a nanometer particle size is 20-50 nm), 0.01-1% of ferrum (Fe), 0.5-4.5% of silver (Ag), 0.2-1.5% of copper (Cu) and the balance stannum (Sn). Sn ingots, Sn-Cu intermediate alloys, Sn-Ag intermediate alloys and Sn-Fe intermediate alloys are matched according to designed and needed ingredients, wherein the Sn ingots, Sn-Cu intermediate alloys, Sn-Ag intermediate alloys and Sn-Fe intermediate alloys are sold on the market. Melting in advance is achieved. Nanometer NiTi particles are added, manufacturing process using high energy ultrasonic stirring is used for smelting the lead-free solder, chemical elements are smelted and casted into bar materials in inert gases protective atmosphere in order to avoid burning loss of the chemical elements, solder wires can be achieved through squeezing and drawing, and new solders can be manufactured into soldering paste to use. The lead-free solder has higher service life in service time.

Description

technical field [0001] The invention relates to a lead-free solder material with high service life and belongs to the field of soldering materials for electronic packaging. It is a new type of lead-free solder with high service life during service. Background technique [0002] In the electronics industry, portable electronic products (notebook computers, mobile phones, PDA, MP3 / MP4 / MP5, etc.) The reliability of electronic devices in electronic products determines the service life of electronic products, and the tens of thousands of solder joints in electronic products determine the service life of electronic devices, so it can be It is said that improving the service life of solder joint materials (solder) is the key to determining the reliability of electronic products, and finding high-performance solder to meet the high reliability requirements of electronic products has become an important research topic in the industry. [0003] In the electronics industry, the tradi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26
Inventor 张亮韩继光郭永环何成文
Owner XUZHOU NORMAL UNIVERSITY