LED chip light source module substrate
A technology of LED chip and light source module, which is applied in the direction of light source, point light source, cooling/heating device of lighting device, etc., can solve the problems of unsatisfactory treatment effect of reflective surface, affecting the light output effect of finished products, and limited light extraction efficiency of products. , to achieve the effect of good light output, strong heat dissipation, and convenient handling.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Publication Date
- 2013-05-08
- Estimated Expiration
- Not applicable · inactive patent
Smart Images
Figure 1 Figure 2 Figure 3
Abstract
Description
technical field
[0001] The invention relates to the technical field of LED light source module substrates, in particular to an improvement technology for LED chip light source module substrates. Background technique
[0002] At present, the more common LED chip light source module substrates on the market do not have a reflective surface specially, and some of them have been treated with a reflective surface. The proportion of the reflective surface to the light surface is not large, and the treatment effect of the reflective surface is not ideal. The light extraction efficiency is limited, and the external lead pads of common LED chip light source module substrates are all on the side of the light output side of the finished product, which affects the overall light output effect of the finished product, and it is inconvenient to apply it in the process of making lamps. Contents of the invention
[0003] The object of the present invention is to provide a LED chip light so...
Examples
Embodiment Construction
[0020] The LED chip light source module substrate of the present invention will be further described in detail below in conjunction with the accompanying drawings.
[0021] Such as Figure 1 to Figure 8 As shown, the LED chip light source module substrate of the present invention, the LED chip light source module substrate, includes two substrates, namely an upper substrate 1, a lower substrate 2 and a PCB board 3, and the PCB board 3 is embedded between the upper substrate 1 and the lower substrate 2 And it is located in the gap area between the upper substrate and the lower substrate, and the two substrates are fixed together by means of riveting and clamping. The upper substrate 1 and the lower substrate 2 are made of high thermal conductivity material, and the PCB board 3 is single-sided or double-sided, and can be designed as one or two pieces according to needs.
[0022] exist figure 1 Among them, the substrate surface 11 is coated with highly reflective materials, and...