LED chip light source module substrate

Abstract

The invention discloses a LED (Light Emitting Diode) chip source module substrate consisting of an upper substrate, a lower substrate and a PCB (Printed Circuit Board), wherein the upper substrate is fixedly connected to the lower substrate, the PCB embedded between the upper and lower substrates is positioned on gap area between the upper and lower substrates, a substrate bowl, a chip welding pad through hole, a riveting column through hole and a PCB-shaped groove are punched on the upper substrate coated with a reflective material layer, an external circuit welding pad through hole and a riveting column are punched on the lower substrate, the PCB provided with a chip welding pad and the external circuit welding pad is positioned on the PCB-shaped groove, the chip welding pad on the PCS directs into the substrate bowl, the external circuit welding pad on the PSB is arranged in the through hole of the external circuit welding pad on the lower substrate, the riveting column through hole on the upper substrate is fixedly connected to the riveting column on the lower substrate. The LED chip light source module substrate has advantages of being high in light extraction efficiency, convenient to connect power supply in using lamps and good in light emitting effect.

Description

technical field [0001] The invention relates to the technical field of LED light source module substrates, in particular to an improvement technology for LED chip light source module substrates. Background technique [0002] At present, the more common LED chip light source module substrates on the market do not have a reflective surface specially, and some of them have been treated with a reflective surface. The proportion of the reflective surface to the light surface is not large, and the treatment effect of the reflective surface is not ideal. The light extraction efficiency is limited, and the external lead pads of common LED chip light source module substrates are all on the side of the light output side of the finished product, which affects the overall light output effect of the finished product, and it is inconvenient to apply it in the process of making lamps. Contents of the invention [0003] The object of the present invention is to provide a LED chip light so...

AI Technical Summary

Problems solved by technology

[0002] At present, the more common LED chip light source module substrates on the market do not have a reflective surface specially, and some of them have been treated with a reflective surface. The proportion of the reflective surface to the light surface is not large, and the treatment effect of the reflective surface is not ideal. The light extraction efficiency is limited, and the external lead pads of common LED chip light source module substrates are all on the side of the light emitting surface of the finished product, which affects the entire light emitting effect of the finished product, and it is inconvenient to apply it in the process of making lamps.

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