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Ionization device and coating device applying same

An ionization and evaporation coating technology, applied in ion implantation coating, sputtering coating, vacuum evaporation coating, etc., can solve the problem of low film density, low evaporation energy, poor adhesion between film and substrate, etc. problem, to achieve the effects of strong binding force, high quality, increased energy and deposition rate

Active Publication Date: 2013-05-29
广州市靓渡塑料镀膜有限公司
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  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in the process of deposition and film formation, the ionization rate of the evaporated material is insufficient, the energy of the evaporated material is low, and the deposition rate is low, resulting in poor adhesion between the coated film layer and the substrate, easy release of the film, and the density of the film layer Smaller, so it is difficult to prepare a better quality film layer

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  • Ionization device and coating device applying same
  • Ionization device and coating device applying same
  • Ionization device and coating device applying same

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Embodiment Construction

[0014] see figure 1 , the ionization device 100 of the present invention, which is used in an evaporation coating device (not shown in the figure), can not only ionize gas, but also ionize vapor atoms or molecules.

[0015] combined reference figure 2 , the ionization device 100 includes a main body 10 and a thermionic emission system 20 , a magnetic field generator 30 and a cooling tank 40 installed on the main body 10 .

[0016] The main body 10 is a tubular structure with openings at the upper and lower ends. The main body 10 includes a side wall 13 , and the side wall 13 defines a cavity 11 . The thickness of the side wall 13 is 1-5 cm, preferably 3 cm. The main body 10 is made of metal or alloy with good electrical and thermal conductivity, such as aluminum, stainless steel or copper, preferably copper. The size of the main body 10 is designed according to the size of the crucible (not shown) in the evaporation coating device. Usually, the diameter of the main body 1...

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Abstract

The invention provides an ionization device used in an evaporation coating device to ionize atoms or molecules of steamed materials. The ionization device comprises a main body, a thermionic emission system and a magnetic field generating device, wherein the thermionic emission system and the magnetic field generating device are installed on the main body; the main body is in a tubular structure and comprises a side wall which defines a cavity; the thermionic emission system comprises a resistance wire arranged in the cavity; direct-current voltage is formed between the resistance wire and the main body; and the magnetic field generating device comprises a dense-turn coil winding the main body and a first power supply communicated with the dense-turn coil. The ionization device has the beneficial effects that the ionization device is applied in the evaporation coating device and can ionize atoms or molecules of the steamed materials and then increase the energy and deposition rates of the steamed materials; and the films prepared by using the ionization device have stronger adhesion to base materials and high quality.

Description

technical field [0001] The invention relates to an ionization device and a film coating device using the ionization device, in particular to an ionization device for improving the ionization rate of steamed material. Background technique [0002] The existing method of coating with an evaporation coating device is: under vacuum conditions, use an electron beam or a thermal resistance wire to heat the steamed material placed in the crucible to the evaporation temperature, so that the steamed material is evaporated and deposited on the A film layer is formed on the substrate. However, in the process of deposition and film formation, the ionization rate of the evaporated material is insufficient, the energy of the evaporated material is low, and the deposition rate is low, resulting in poor adhesion between the coated film layer and the substrate, easy release of the film, and the density of the film layer Smaller, so it is difficult to prepare a film with better quality. Co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/32
CPCC23C14/32
Inventor 黄登聪彭立全
Owner 广州市靓渡塑料镀膜有限公司