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Bonding area design for bonded structures

A technology of areas and connectors, applied in the direction of electrical components, electro-solid devices, circuits, etc.

Active Publication Date: 2016-08-24
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This makes bridging more likely

Method used

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  • Bonding area design for bonded structures
  • Bonding area design for bonded structures
  • Bonding area design for bonded structures

Examples

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Embodiment Construction

[0030] The making and using of various embodiments of the invention are discussed in detail below. It should be appreciated, however, that the embodiments provide many applicable concepts that can be implemented in a wide variety of specific contexts. The specific embodiments discussed are illustrative only, and do not limit the scope of the invention.

[0031] Packages including bump-on-trace (BOT) structures are provided according to embodiments. Variations of these examples are discussed. Like numerals are used to refer to like elements throughout the various views and illustrative embodiments.

[0032] figure 1 A cross-sectional view of a package component 100 according to an embodiment is shown. Package component 100 may be a device die including active devices 103 , such as transistors, therein. Alternatively, packaged component 100 may be a passive component having no active devices therein. In embodiments where package component 100 is a device die, substrate 102...

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Abstract

The invention relates to a device including first and second packaging components. Metal traces are provided on the surface of the first package component. The metal trace has a length direction. The metal trace includes a portion having an edge, wherein the edge is not parallel to a length direction of the metal trace. The second packaging component includes a metal pillar, wherein the second packaging component is disposed above the first packaging component. A solder area joins the metal post to the metal trace, wherein the solder area contacts the top surface and sides of the metal trace portion. The present invention also provides a joint area design of the joint structure.

Description

technical field [0001] The present invention relates to the field of semiconductors, and more specifically, the present invention relates to a design of a bonding region of a bonding structure. Background technique [0002] Bump-on-trace (BOT) structures are used in flip-chip packages where metal bumps are bonded directly to narrow metal traces in the package substrate rather than to metal pads, which The width of the pad is greater than the width of the corresponding connecting metal trace. The BOT structure requires a smaller chip area, and the manufacturing cost of the BOT structure is lower. The reliability of the traditional BOT structure may be the same as that of the traditional bonding structure based on metal pads. [0003] Since existing BOT structures have very small spacing, adjacent BOT structures may bridge each other. In particular, BOT structures located in the peripheral area of ​​the package are easier to bridge due to the high density of BOT structures ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/488
CPCH01L2224/16225H01L2924/15311H01L2924/01322H01L2224/13015H01L24/13H01L24/16H01L24/81H01L2224/05016H01L2224/05022H01L2224/13014H01L2224/13083H01L2224/81191H01L2224/81385H01L2224/05572H01L2224/13144H01L2224/13147H01L2224/13155H01L2224/13164H01L2224/131H01L2924/00014H01L2224/0401H01L2924/00011H01L23/49838H01L2224/13012H01L2924/00H01L2924/00012H01L2924/014H01L2224/05552H01L2224/81805
Inventor 张志鸿郭庭豪陈承先
Owner TAIWAN SEMICON MFG CO LTD