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An electronic circuit board using a metal circuit sheet and an electronic packaging module thereof

A metal circuit sheet, electronic packaging technology, applied in the direction of circuit substrate materials, circuits, electrical components, etc., can solve the problems of easy high temperature meltdown, circuit board damage, damaged equipment, etc., to reduce copper loss, prevent current interference, reduce heat accumulation effect

Inactive Publication Date: 2016-03-16
KING SHING IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the car is running, the temperature of the engine compartment will be kept at a high temperature for a long time. As a result, the printed circuit board will be damaged due to the high temperature generated by the passive components soldered on it, especially in the It is easy to melt at high temperature when it is loaded with high current for a long time, and damage other equipment around it

Method used

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  • An electronic circuit board using a metal circuit sheet and an electronic packaging module thereof
  • An electronic circuit board using a metal circuit sheet and an electronic packaging module thereof
  • An electronic circuit board using a metal circuit sheet and an electronic packaging module thereof

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Embodiment Construction

[0044] The present invention will be further described below in combination with illustrations and specific operation examples.

[0045] see figure 1 Shown is the metal circuit sheet 10 used in the electronic circuit board of the present invention. There are various metal sheets with different geometric shapes, which together constitute the conduction path of charges. figure 2 Shown is the package body 15 used in the electronic circuit board of the present invention, which has two openings of different sizes: a single opening 12 and a double opening 13 .

[0046] see image 3 , 4 shows an embodiment of the electronic circuit board of the present invention, image 3 It is a perspective view of the back structure of the electronic circuit board, Figure 4 It is a schematic diagram of the inner surface of the electronic circuit board and the structure of the electronic components. In this embodiment, metal sheets are used to form a current path, including several metal circu...

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Abstract

The invention discloses an electronic circuit board using a metal circuit sheet and an electronic packaging module thereof, which includes several metal circuit sheets with geometric shapes; an insulating electrical package, which is coated with the metal circuit sheet to form an electronic circuit board, And isolate the metal circuit sheets to avoid contact with each other and conduct current. The package body has several openings to expose the metal circuit sheets on a plane; and several electronic components are arranged on the openings to form electrical connections with the metal circuit sheets. The electronic components pass through the metal circuits. The chips are interconnected to form a circuit.

Description

technical field [0001] The invention relates to an electronic circuit board, in particular to an electronic circuit board using a metal circuit sheet and an electronic packaging module thereof. Background technique [0002] Printed Circuit Board (Printed Circuit Board referred to as PCB) is based on the circuit design, draws the electrical wiring connecting the circuit parts into a wiring pattern, and then reproduces the electrical conductor on the insulator by the mechanical processing and surface treatment specified by the design. In other words, the printed circuit board is the substrate before matching the electronic parts. Its function is to use the electronic circuit formed by the electronic parts with the circuit board to play the functions of the electronic components to achieve the purpose of signal processing. [0003] The main function of the PCB is to provide the mutual current connection of various parts. The base of the board itself is made of a material that i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K1/03H05K1/18H01L23/498
Inventor 施春景
Owner KING SHING IND
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