A temperature control method and device for an anti-reflection film preparation furnace
A temperature control method and a technology of a temperature control device, which are applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of not being able to meet the optimal temperature of the anti-reflection film and the uniformity of the anti-reflection film.
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Embodiment 1
[0023] see figure 1 , figure 1 A flowchart of a temperature control method for an anti-reflection film preparation furnace provided in Embodiment 1 of the present invention, as shown in figure 1 As shown, the method of this embodiment may include the following steps:
[0024] 101. Set a center temperature value correspondingly to several temperature zones pre-divided into each furnace tube.
[0025] Optionally, the anti-reflection film preparation furnace of the present invention can adopt the German centrotherm furnace.
[0026] Among them, since in the actual production process, the intake and exhaust gas of the furnace will cause a certain temperature difference between each furnace tube from the furnace mouth to the furnace tail, so each furnace tube of the anti-reflection film preparation furnace can be placed from the furnace mouth At the end of the furnace, several temperature zones are divided, and then the temperature of each temperature zone is controlled separate...
Embodiment 2
[0034] see figure 2 , figure 2 A flow chart of a temperature control method for an antireflection film preparation furnace provided in Embodiment 2 of the present invention, as shown in figure 2 As shown, the method of this embodiment may include the following steps:
[0035] 201. Divide each furnace tube into five temperature zones from the furnace mouth to the furnace tail.
[0036] In one embodiment, each furnace tube is divided into five temperature zones from the furnace mouth to the furnace tail, and each temperature zone is named as: LZ, CLZ, CZ, CGZ, GZ respectively from the furnace mouth to the furnace tail.
[0037] 202. Set a central temperature value corresponding to each temperature zone.
[0038] Wherein, considering the temperature requirements for preparing the anti-reflection film, the set central temperature value may range from 430°C to 465°C.
[0039] Since the intake and exhaust of the furnace tube will affect the temperature of the furnace tube, in...
Embodiment 3
[0058] see image 3 , image 3 A structural diagram of a temperature control device for an anti-reflection film preparation furnace provided in Embodiment 3 of the present invention, as shown in image 3 As shown, the device of this embodiment may include:
[0059] The first setting unit 301 is used to set a central temperature value correspondingly to several temperature zones pre-divided into each furnace tube;
[0060] The second setting unit 302 is used to set a fine-tuning temperature value for each temperature zone of each furnace tube, and the fine-tuning temperature value ranges from -10°C to 10°C;
[0061] The superposition unit 303 is configured to superimpose the central temperature value set by the first setting unit 301 and the corresponding fine-tuning temperature value set by the second setting unit 302 .
[0062] Please also refer to Figure 4 , Figure 4 A structural diagram of another temperature control device for an anti-reflection film preparation fur...
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