Die
A technology of molds and heat shields, applied in the field of molds, can solve the problems of not being able to adapt to the requirements of product upgrading and quality improvement, and the requirements are getting higher and higher, so as to achieve the effect of improving cooling effect, high product quality, and improving product quality
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0017] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.
[0018] Refer below figure 1 A mold 1 according to an embodiment of the present invention is described. Such as figure 1 As shown, the mold 1 according to the embodiment of the present invention includes a top plate 20 , an upper heat insulation plate 40 , an upper mold plate 50 , a lower mold plate 60 , a lower heat insulation plate 70 and a bottom plate 80 .
[0019] The upper heat insulation board 40 is provided on the lower surface of the top board 20 , and the upper heat insulation board 40 has a main flow channel therein. The upp...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 