Array substrate and maintenance method thereof, display device

Abstract

The embodiment of the invention provides an array substrate and a maintenance method thereof, and relates to the technology of liquid crystal display. A peripheral maintenance wire and a metal bridge insulated from a data wire originally existing inside the array substrate are arranged inside the array substrate; the peripheral maintenance wire is used for replacing the disconnected data wire by introducing the peripheral maintenance wire when the data wire in a data wire layer is disconnected; the metal bridge is used for connecting the disconnected data wire and the peripheral maintenance wire when the data wire in the data wire layer is disconnected; and through the connection among the peripheral maintenance wire, the metal bridge and the data wire originally existing inside the array substrate, the peripheral maintenance wire is used for replacing the disconnected data wire so as to realize disconnection maintenance after the manufacturing of the array substrate is finished. The peripheral maintenance wire is arranged inside the array substrate, and is connected with the data wire and the metal bridge through via holes, so that the convenience of disconnection maintenance after the manufacturing of the array substrate is finished and the wire stability after maintenance are improved.

Description

technical field [0001] The invention relates to liquid crystal display technology, in particular to an array substrate, a maintenance method thereof, and a display device. Background technique [0002] At present, the maintenance of data line disconnection of Thin Film Transistor-Liquid Crystal Display (TFT-LCD) mostly occurs in the array (array) stage. By laser cutting the disconnection position and depositing the conductive position, the disconnection will be removed. Line maintenance is normal. After the color film (CF) box is assembled, the array substrate (MDL) is manufactured, and the laser-deposited conductive material cannot reach the surface of the array, and the broken data line cannot be repaired. Only the peripheral wiring can be used to conduct the broken line. Therefore, at present, after the array substrate is manufactured, it is inconvenient to repair disconnected wires. If the peripheral wiring is performed, the peripheral wiring will inevitably expose the ...

AI Technical Summary

Problems solved by technology

After the color film (CF) box is assembled, the array substrate (MDL) is manufactured, and the laser-deposited conductive material cannot reach the surface of the array, and the broken data line cannot be repaired, and only the peripheral wiring can be used to conduct the broken line.

Therefore, at present, after the array substrate is fabricated, it is inconvenient to repair disconnected wires. If the peripheral wiring is carried out, the peripheral wiring will inevitably expose the wiring area to the outside, which will have a certain impact on the stability of the circuit.

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