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A turning-grinding compound profiling machine tool and its slotting method

A profiling machine tool, turning and grinding technology, applied to other manufacturing equipment/tools, manufacturing tools, etc., can solve problems such as inability to detect workpieces online, difficult operation, and roughening, so as to avoid roughening, reduce processing time, and improve efficiency Effect

Inactive Publication Date: 2015-11-18
上海启先新能源科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] Aiming at the disadvantages of the existing technology, such as difficult operation, high cost, low efficiency, error overrun and fluffing, time-consuming discovery of defects, and inability to detect the workpiece on-line, the present invention provides a turning-grinding compound profiling machine tool and its slotting method

Method used

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  • A turning-grinding compound profiling machine tool and its slotting method
  • A turning-grinding compound profiling machine tool and its slotting method
  • A turning-grinding compound profiling machine tool and its slotting method

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Embodiment Construction

[0029] Embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

[0030] figure 1 , figure 2 , image 3 Respectively show schematic diagrams of different angles of the turning-grinding compound profiling machine tool of the present invention, with reference to the illustrations, the turning-grinding compound profiling machine tool of the present invention comprises a bed body 1, a workpiece shaft spindle box 2 arranged on the bed body 1, a mold feed Mechanism 3, profiling mold 4, workpiece 5, auxiliary loading and unloading device 6, tailstock assembly 7, turning tool turret 8, tool feeding mechanism 9, guide rail 10 laid on the upper surface of bed body 1, mold feeding mechanism 3 , the tool feeding mechanism 9, the tailstock assembly 7 and the turning tool turret 8 can move along the guide rail 10 to adjust the position. Among them, the machine bed body 1 is the basic part of the whole machine tool, the w...

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Abstract

The invention provides a lathing and grinding combined copying machine and a slotting method thereof. The lathing and grinding combined copying machine comprises a machine body, wherein a copying mold and a workpiece are arranged on the upper surface of the machine body in parallel. The workpiece is clamped through a tailstock assembly arranged at one end of the upper surface of the machine body and a workpiece shaft main shaft box arranged at the other end of the upper surface of the machine body. A loading and unloading assisting device is arranged below the workpiece. A guiding rail is further arranged on the upper surface of the machine body. A mold feeding mechanism and a cutting feeding mechanism are arranged on the guiding rail. A copying mold is clamped by the mold feeding mechanism. The cutter feeding mechanism is arranged at the outer side of the tailstock assembly. A lathe tool tower is arranged on the cutter feeding mechanism. The invention further provides the slotting method of the lathing and grinding combined copying machine. According to the lathing and grinding combined copying machine and the slotting method of the lathing and grinding combined copying machine, one-time forming is achieved, efficiency is greatly improved, machining time is shortened, meanwhile a galling phenomenon occurring in lathing item by item is avoided, an online detection device can be offered and shortage repairing operation can be achieved without secondary clamping.

Description

technical field [0001] The invention relates to a turning-grinding compound profiling machine tool, which is applied to one-time forming profiling grinding processing of main rolls of multi-wire cutting machines, in particular to the grooving technology of main rolls of multi-wire cutting machines for silicon rod cutting. Background technique [0002] At present, the grinding technology is very mature and widely used in precision machining, but profiling grinders, especially large-size and micro-structure profiling grinders, have not been applied, especially in the field of multi-wire cutting, the main roller groove for cutting steel wire still needs Processed piece by piece. Multi-wire cutting technology is widely used in solar photovoltaic, LED, semiconductor manufacturing and other fields. It is currently the best method for cutting non-conductive materials such as solar silicon wafers, LED sapphire substrates, semiconductor silicon wafers (chips), magnets, and ceramics. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23P23/02
Inventor 林敏华薛春良李乐
Owner 上海启先新能源科技有限公司
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