Single-point thickness measurement method of SMT screen plate

Abstract

The invention relates to the technical field of laser processing, in particular to a screen plate thickness measurement method. According to the method, the coordinate of a measurement point on a screen plate breadth is (x,y), firstly a laser displacement sensor is moved to the measurement point through shafting motions, measurement is started and thickness data are obtained. The method further includes the following steps: setting a radius r for representing a position range, moving the laser displacement sensor within the position range of the radius r according to a set path, constantly measuring the thickness of the screen plate in the moving process and storing the data until scanning of the laser displacement sensor is completed and the laser displacement sensor returns to the point (x,y), and eventually indicating the thickness of the measurement point with the average value of the obtained thickness data. According to the technical scheme, the thickness of the measured screen plate is obtained, thickness measurement precision of the SMT screen plate is improved, and errors are reduced.

Description

[0001] technical field [0002] The invention relates to the technical field of laser processing, in particular to a method for measuring the thickness of a stencil. [0003] Background technique [0004] In the laser microprocessing industry, it is necessary to measure the thickness of the SMT stencil to check whether the stencil meets the requirements. Generally, a certain number of points are taken at average intervals in the stencil format, and the thickness of these points is measured to represent the average thickness of the stencil, such as figure 1 As shown, the average thickness of 9 points on the screen 1 is taken to represent the thickness of the screen 1 . [0005] The conventional measurement method only takes one point when measuring the thickness of the point, and does not take into account the flatness of the stencil in the vicinity, so it cannot represent the thickness of the position near the point, such as figure 2 As shown, from the cross-section of t...

AI Technical Summary

Problems solved by technology

[0005] The conventional measurement method only takes one point when measuring the thickness of the point, and does not take into account the flatness of the stencil in the vicinity, so it cannot represent the thickness of the position near the point, such as figure 2 As shown, from the cross-section of the stencil, the thickness of the stencil near a certain point will be very different from the thickness of the point

Therefore, using the average value of the point position thickness obtained by this measurement method to represent the thickness of the stencil will lead to large data errors and affect the quality of industrial production

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