LED packaging structure and LED packaging method

Abstract

The invention relates to a light-emitting diode (LED) packaging structure which comprises a printed circuit board (PCB), a reflection layer, a light-transmitting carrier, a light-emitting layer, an LED chip and a silica gel layer. The reflection layer is arranged on the PCB, an opening area is arranged on the reflection layer, the PCB is partially exposed to the opening area, the light-transmitting carrier is arranged on the reflection layer and can enclose a cavity with the reflection layer and the PCB exposed to the opening area, the LED chip is arranged on the PCB exposed to the opening area, the silica gel layer is arranged in the cavity and used for sealing the LED chip, and the light-emitting layer is arranged on the light-transmitting carrier. The LED packaging structure has the advantages of being high in light-emitting efficiency, long in service life and good in light color uniformity. The invention further provides an LED packaging method.

Description

technical field [0001] The invention relates to the field of LED lighting, in particular to an LED packaging structure and an LED packaging method. Background technique [0002] The light sources used in the production of lighting fixtures and backlight products on the market are mainly SMD (Surface Mounted Devices, Surface Mount Devices) packaged LED light sources and COB (Chip On Board, Chip On Board) packaged LED light sources. However, the cost of SMD packaging is relatively high, and the obtained light source has the problem of poor light color uniformity and consistency. Therefore, SMD packages are gradually being replaced by relatively low-cost COB packages. COB packaging can not only manufacture high-power LED light source products, but also the obtained light source has the advantages of small thermal resistance, relatively uniform light, and convenient application. [0003] Traditional COB-packaged LED light sources are usually coated with phosphor powder directl...

AI Technical Summary

Problems solved by technology

[0003] Traditional COB-packaged LED light sources are usually coated with phosphor powder directly on the blue or purple LED chip. Since the phosphor powder is directly coated on the LED chip, the high heat generated by the LED chip will cause high-temperature aging of the phosphor powder, which will affect the LED. Light source life

Moreover, the high heat generated by the LED chip will also reduce the excitation efficiency of the phosphor, resulting in the luminous efficiency of the finished light source being much lower than the theoretical luminous efficiency.

In addition, the phosphor powder is directly coated on the LED chip. The phosphor coating layer is affected by the structure of the LED chip, and there will be problems with uneven distribution of phosphor powder, resulting in poor light color consistency and the appearance of LEDs packaged in the same COB. Inconsistent colors in different areas of the light source

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