66results about How to "Improve light color consistency" patented technology

The invention discloses a standard dot matrix light source and an image point correction method of a light-emitting diode (LED) display screen. The method comprises the following steps of: A, constructing the standard dot matrix light source, and calibrating the brightness and the chroma of the standard dot matrix light source; B, acquiring image data of the LED display screen, and the brightness and the chroma of the standard dot matrix light source; C, comparing the acquired brightness and chroma of the standard dot matrix light source with a stored value to obtain an error compensation matrix, and converting the image data of the LED display screen from a relative value into an absolute value; D, analyzing the converted image data of the LED display screen to generate a data correction coefficient matrix; and E, outputting the data correction coefficient matrix to an image point correction processor to perform image data correction processing so as to obtain corrected image data according to the data correction coefficient matrix, and finally outputting the corrected image data to an LED large screen display system. The standard dot matrix light source and the image point correction method can overcome adverse effects caused by working condition drifting of a camera to ensure that the LED display screen has better light-color consistence and white balance after performing the image point correction; and an additional light colorimeter is not needed, and a plurality of times of tests are not performed any more.

The invention discloses a phosphor powder film making method and obtained phosphor powder film encapsulating method. The invention is characterized in that a method spinning phosphor powder glue is adopted to independently make phosphor powder film in encapsulating process, then the phosphor powder film is covered on an LED chip coated with heat insulating material, and finally the heat insulating material is cured to complete white-light LED phosphor powder coating. The quantity of LED chip is one or more than one. The invention is simple in technology and low in making cost, can accurately control the thickness of phosphor powder film, greatly improves light color consistency of LED product, is applicable to large scale industrialized production and adopts heat insulating encapsulating manner to solve heat dissipation problem of LED and reduce lumens depreciation, so that light color is more stable.

The invention discloses a white light emitting diode with high color rendering property and a white light emitting diode lamp. The white light emitting diode comprises a heat conducting substrate, a light reflecting cup, a light emitting diode chip and a lead wire frame, wherein the light reflecting cup plays a light mixing role, and small protrusions are arranged on the inner wall surface of the light reflecting cup; the light emitting diode chip outputs at least six lights in different colors and is arranged on the heat conducting substrate to carry out electric combination; the lead wire frame is matched with the bottom of a light emitting cup in shape and size, arranged outside the light reflecting cup, and fixed on the upper surface of a base; an electrode of the chip is electrically connected with a lead wire on the lead wire frame, and a transparent optical material is covered on the chip; and polychromatic lights are evenly mixed through the diffuse reflection of a reflecting wall of the light reflecting cup to produce the white light emitting diode with high color rendering property and high efficiency. By applying the white light emitting diode lamp made of the white light emitting diode and a flat light source, the white light emitting diode lamp eliminates the light energy loss of fluorescent powder in the photochromic conversion process, thereby having high electro-optical conversion efficiency, long service life and convenient batched production.

The invention relates to a packaging process of a white light LED (light emitting diode). The packaging process comprises a die bonding step, a wire bonding step, an adhesive preparing step, a dispensing step, a fluorescent powder precipitating step and an adhesive solidifying step, wherein in the fluorescent powder precipitating step, one of a centrifugal precipitation method, a baking precipitation method or a room temperature natural precipitation method is adopted or more of the centrifugal precipitation method, the baking precipitation method and the room temperature natural precipitation method are combined to ensure fluorescent adhesives to be divided into an upper packaging adhesive layer and a lower fluorescent powder layer covering an LED chip in a reflecting cup to ensure at least most fluorescent powder in the fluorescent adhesives to be precipitated on the fluorescent powder layer; and in the adhesive solidifying step, the reflecting cup after precipitation is continuously put in an oven to be baked to solidify the packaging adhesives in the reflecting cup and the packaging adhesives are taken out of the reflecting cup after being solidified. By adopting the packaging process, the problem that the light colors of the white light LEDs generated by the existing packaging processes of the white light LEDs have poorer consistency is mainly solved and the aim of ensuring the consistency of the light colors of the generated white light LEDs to be better is achieved.

The invention provides a light-emitting diode (LED)-exposed waterproof perforated lamp string and a manufacturing method thereof. The LED-exposed waterproof perforated lamp string is formed by combining LED lamps, printed circuit boards (PCBs) and anti-ultraviolet (anti-UV) polyurethane (PU) wires together in a welding mode and an epoxy resin glue embedment mode and solidifying at the high temperature of between 50 and 60 DEG C. The problem that modified epoxy resin and polyvinyl chloride (PVC) cables cannot be firmly adhered and the problem of waterproof performance treatment are radically solved. When the LED-exposed waterproof perforated lamp string is actually used, a plurality of perforated lamps are connected together by a parallel circuit according to a certain rule; the LED-exposed waterproof perforated lamp string has the advantages of simple structure, low cost, long service life, large light-emitting angle, low light attenuation, uniform aperture, low power consumption, energy conservation and environment friendliness, is stable in work and safe in use and is driven by direct current (DC) the constant voltage of 5V; and a special bayonet design is adopted, and the perforated lamps are directly mounted after being perforated, so that mounting cost is lowered, the LED-exposed waterproof perforated lamp string is convenient to maintain, and various boards can be used after being perforated. The perforated lamps are designed in a bidirectional disassembling and assembling separated mode, so that the perforated lamps are easier to maintain and have wide application prospects.

The invention aims at providing a light-emitting diode (LED) packaging method capable of obtaining high luminous efficiency, low light attenuation and high light color uniformity in LED chip packaging by using a substrate with an optical design and high diffuse reflection (200-760nm waveband reflectivity R>=80%), and the method is applicable to packaging for various LED chips especially white light LED chips of the various LED chips. The substrate 10 for an LED is characterized in that surface treatment is conducted on the substrate 10 and a high diffuse reflection layer 102 is formed on the surface 101 of the substrate 10. An LED packaging structure is characterized by comprising electrodes 501 and 502, an LED chip 20 and sealing objects 40, wherein the electrodes 501 and 502 are formed on the substrate 10, the LED chip 20 is fixed on the high diffuse reflection layer 102 of the packaging substrate in die bonding mode, and the sealing objects cover the LED chip 20 and the high diffuse reflection layer 102. The LED packaging method has the advantages that the reflection cylindrical surface of light coming out from the bottom of the chip is expanded uniformly enough to form a large-angle sector surface (radian close to 170-degree KLMNOJ) through high diffuse reflection of the substrate surface, so that fluorescent powder can be excited and accordingly luminous efficiency higher than that of a traditional silver-plated mirror surface reflection film is obtained, and good light color uniformity is guaranteed.

The invention relates to the technical field of light-emitting diodes, in particular to a process for encapsulating a high-power light-emitting diode. The process for encapsulating a light-emitting diode comprises the following steps: applying glue and then keeping a light-emitting diode static at normal temperature to 102 DEG C for a period of time; depositing fluorescent powder in glue and leading the fluorescent powder to be attached to the surface of a chip. The invention eliminates a yellow aperture formed after the light-emitting diode is projected. Colors of light spots projected by thelight-emitting diode are consistent and even, and the light color quality of the light-emitting diode is improved.

The invention relates to a dispensing method applicable to a flip chip. The dispensing method applicable to a flip chip comprises the following steps of: A, preparing curing colloidal particles: uniformly mixing AB glue and fluorescent powder accounting for 7-15% of the weight of AB glue, and preparing liquid fluorescent glue; B, defoaming the liquid fluorescent glue prepared in the step A and sealing, and quickly freezing at low temperature below 15 DEG C to obtain solid fluorescent glue; C, cutting the solid fluorescent glue prepared in the step B: putting the solid fluorescent glue in an atmosphere full of low-temperature nitrogen, cutting the solid fluorescent glue into uniform particles, and sealing the particles and storing in an environment below -15 DEG C, wherein the temperature of the low-temperature nitrogen is below -5 DEG C; and D, putting the uniform particles prepared in the step C in a light cup with a fixed flip chip, and roasting for forming.

The invention belongs to the related field of semiconductor manufacturing technologies, and discloses a high-thermal stability chip-scale LED (Light Emitting Diode) packaging method. The method comprises the steps of firstly mounting a plurality of LED chips on a ceramic substrate by eutectic bonding, then coating the ceramic substrate with fluorescent glass paste, obtaining a fluorescent glass layer on the top and side surfaces of the chips through low-temperature sintering, and then cutting to obtain LED devices; or firstly, eutectic bonding a plurality of LED chips on a ceramic substrate, then coating the side surfaces of the chips with a light shielding layer, then bonding a prepared fluorescent glass sheet to the top of the chips, and finally cutting to obtain LED devices. The invention further discloses a corresponding LED packaging structure. According to the invention, problems of fluorescent layer aging and carbonization caused by chip heating under high current density are effectively avoided, the thermal stability of the LED devices is improved, and the method is particularly suitable for solving the technical problems such as production efficiency and photochromic consistency in the chip-scale LED packaging process.

The invention discloses a white light LED containing a liquid quantum dot, and a preparation method thereof. The preparation method of the white light LED containing a liquid quantum dot comprises thefollowing steps: diluting the liquid quantum dot, configuring slurry, printing and drying screen mesh, sintering at low temperature, packaging and solidifying. The invention effectively avoids blue light hazard, obviously improves the color rendering index and the consistency of light color of the white light LED, reduces the color temperature of LED, and effectively slows down light efficiency reduction caused by aging of organic polymer.

The invention provides a high photosynthetic efficiency high-voltage alternating-current white light LED (light emitting diode) module and white light acquiring method in different mesopic vision environments. The LED module comprises a substrate, high-voltage LEDs and an alternating-current drive control circuit, wherein the high-voltage LEDs of preset quantity which are connected in serial are fixed on the substrate; each high-voltage LED comprises a high-voltage blue light chip, a high-voltage orange light chip and an encapsulation layer which is used for encapsulating the high-voltage blue light chip and the high-voltage orange light chip and contains green fluorescent powder; among the serially-connected high-voltage LEDs, the high-voltage blue light chip and the high-voltage blue light chip are connected in series to form a blue light group, and the high-voltage orange chip and the high-voltage orange light chip are connected in series to form an orange group; the alternating-current drive control circuit comprises a bridge-type rectifying circuit, a constant current module and a current adjustable module; the current provided by an alternating-current power supply is divided by the bridge-type rectifying circuit into two circuits, the two circuits of current are respectively supplied to the constant current module to be used as the drive of the blue light group and to the current adjustable module to be used as the drive of the orange light group so as to independently adjust the drive current of each high-voltage orange light chip; the module has ultrahigh mesopic vision light efficiency in different mesopic vision environments.

The invention discloses a lens-type SMD packaging device, which includes a bracket, at least two welding pads are arranged on the inner bottom of the bracket, a light-emitting chip is correspondingly arranged above the welding pads, and welding pads are arranged between the welding pads. Isolated baffles. The pads are independent of each other, and the pads are separated by a partition, so that the luminous angle of the light emitted by the light-emitting chip above each pad is consistent with the optical curve and does not affect each other, and there will be no cross-lighting. High light overlap and good light color consistency. There is also an encapsulation lens above the light-emitting chip, which greatly improves the brightness of the LED device, and the curvature of the lens can be adjusted according to different needs to adjust the light-emitting angle and light-emitting curve of the device, so that the product can meet the requirements of high brightness, good light color consistency, Energy-saving market demand.

The invention relates to an equipment system for laminating and packaging an LED based on a rolling type thermoplastic resin light conversion body. The characteristics lie in that the equipment system comprises a collaborative rolling shape-fixing and cutting device used for performing rolling shape-fixing and rolling cutting on a light conversion diaphragm so as to form a light conversion diaphragm array and a rolling laminating device used for laminating the light conversion diaphragm array and an LED flip chip array; the collaborative rolling shape-fixing and cutting device and the rolling laminating device sequentially form collaborative linkage process equipment; the collaborative rolling shape-fixing and cutting device comprises a rolling device 1 with a bump array and a rolling device 2 with a groove array which are oppositely arranged in an aligned manner; and the rolling laminating device comprises a rolling device 4 with a groove array and a rolling device 3 with the rolling surface being a smooth surface which are oppositely arranged in an aligned manner. The equipment system meets requirements of a technological method suitable for laminating and packaging the LED based on the thermoplastic resin light conversion body, so that the production efficiency and the superior quality product rate of industrial batch LED packaging are improved.

The invention relates to a non-organic-glue wafer-level package method and an LED flip chip package body. The package method enables glass having a phosphor layer to be directly bonded to a light output surface of an LED flip chip in a low-temperature bonding manner, so that the whole LED package body is free from organic glue package, and the defects of organic glue package are avoided.