LED filament light source, LED filament bulb lamp and production method thereof

A technology of LED filament and bulb lamp, which is applied in the direction of light source, light source fixing, semiconductor device of light-emitting element, etc., can solve the problems of good heat dissipation performance and poor heat dissipation of LED filament, achieve good scattering performance and improve light color consistency , perfect uniformity effect

Inactive Publication Date: 2016-11-23
SHENZHEN HOYOL OPTO ELECTRONICS
View PDF5 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to overcome the disadvantages of poor heat dissipation of LED filaments in the prior art, and provide an LED filament light source with good heat dissipation performance

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • LED filament light source, LED filament bulb lamp and production method thereof
  • LED filament light source, LED filament bulb lamp and production method thereof
  • LED filament light source, LED filament bulb lamp and production method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] In order to make the object, technical solution and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0020] It should be noted that when an element is referred to as being "fixed" or "disposed on" another element, it may be directly or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element.

[0021] It should also be noted that the orientation terms such as left, right, up, and down in the embodiments of the present invention are only relative concepts or refer to the normal use state of the product, and should not be regarded as restrictive .

[0022] Such as figure 1 As shown, ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
angleaaaaaaaaaa
transmittivityaaaaaaaaaa
Login to view more

Abstract

The invention discloses an LED filament light source, an LED filament bulb lamp and a manufacturing method thereof. The LED filament light source comprises a tungsten-copper metal composite heat dissipation substrate, and a high heat-conducting insulating substrate formed on the surface of the tungsten-copper metal composite heat dissipation substrate by magnetron sputtering. layer, several conductive copper layers arranged in an array on the surface of the high thermal conductivity insulating layer generated by magnetron sputtering and electroplating, a solder paste layer arranged on each conductive copper layer, eutectic soldering on the solder paste layer, and microlenses capped on the flip chip. The present invention adopts flip-chip, tungsten-copper metal composite heat-dissipating substrate, high thermal conductivity insulating layer, combined with flip-chip welding and eutectic technology to realize the high current and low thermal resistance channel between the flip-chip and the substrate, and has good heat dissipation performance; Materials with high thermal conductivity are used between the center point of the heat source of the flip chip and the heat dissipation substrate, which greatly reduces the thermal resistance and improves the reliability of the LED filament light source.

Description

technical field [0001] The invention belongs to the technical field of LED semiconductor lighting, and in particular relates to an LED filament light source, an LED filament bulb lamp and a method for manufacturing the LED filament bulb lamp. Background technique [0002] At present, the luminous efficiency of LED is much higher than that of incandescent lamps, and it has begun to enter the field of general lighting, which accounts for 30%-40% of global power consumption, and has become an important way to significantly reduce lighting power consumption and save energy. It can be seen that LED lighting will continue to innovate in the direction of high efficiency, energy saving, clean environmental protection and high cost performance, and promote the implementation of global energy saving and emission reduction projects. But LED has been struggling to enter the field of general lighting. Although the packaging of the large-angle LED light source allows the LED to achieve t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/64H01L33/58F21K9/232F21V19/00F21V23/00F21V29/85F21Y115/10
CPCH01L33/48F21V19/0015F21V23/003F21V29/85H01L33/58H01L33/641H01L33/647
Inventor 鲍锋辉李春雷冯杰
Owner SHENZHEN HOYOL OPTO ELECTRONICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products