A cob modular led dispensing structure

A modular, LED chip technology, applied to point light sources, lighting and heating equipment, electrical components, etc., can solve the problem of free flow of phosphor glue, improve light color consistency, reduce manufacturing costs, and simplify dispensing material effect

Inactive Publication Date: 2011-12-07
JIANGSU SUN & MOON LIGHTING
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  • Summary
  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0003] The purpose of this invention is to design a COB modular LED dispensing structure to solve the problem of free flow of fluorescent powder glue in the traditional COB packaging structure, realize uniform phosphor coating, and eliminate the color temperature difference between different LEDs

Method used

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  • A cob modular led dispensing structure
  • A cob modular led dispensing structure
  • A cob modular led dispensing structure

Examples

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Effect test

Embodiment 1

[0013] Embodiment 1: as Figure 4 As shown, on the strip-shaped aluminum substrate 1, 12 1-watt LED chips 2 are directly bonded, and each LED chip 2 is surrounded by a rubber ring 4. After the LED chips 2 are evenly coated with phosphor powder, they are packaged separately. An optical lens 3 whose light distribution meets road lighting requirements forms an LED package module specially used for road lighting. In the above-mentioned packaging process, since there is an apron around the environment where the chip is coated with rubber powder to limit the flow of the rubber powder, the orderly flow of the rubber powder is realized, and the uniformity of the phosphor powder coated on the chip is ensured; at the same time, the powder coating It is carried out in an environment of 15°C--20°C, and the process from coating to solidification is completed in the apron ring.

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Abstract

The invention belongs to LED dispensing technology, in particular to a COB (Chip on Bord) modular LED dispensing technology. The LED structure involved includes: COB consists of four parts: aluminum substrate, LED chip, optical lens, and rubber ring. The rubber ring is fixed on the substrate, and the LED chip is directly solidified on the substrate in the middle of the rubber ring. The ambient temperature is controlled at 15°C-20°C. In the process of dispensing, due to the existence of the surrounding rubber ring and the ambient temperature of 15°C-20°C, it can effectively block the flow of phosphor glue, and at the same time improve the consistency of the phosphor coating to obtain a consistent color temperature. The invention adopts the COB (Chip on Bord) modular LED dispensing technology, which can solve the common color difference problem in the current COB technology.

Description

technical field [0001] The invention relates to a COB modular LED glue dispensing technology, which is suitable for the process of coating fluorescent powder on chips, and belongs to the colloidal fluid overflow limiting technology. technical background [0002] The existing LED chip COB packages are all on the plane of an aluminum substrate, and glue is directly applied to each chip to form individual light sources. Since the LED chip and the aluminum substrate are on the same plane, when applying phosphor glue, the glue will flow freely, resulting in very uneven phosphor coating, resulting in significant differences in color temperature between LEDs on the same aluminum substrate . Contents of the invention [0003] The purpose of the present invention is to design a COB modular LED glue dispensing structure to solve the problem of free flow of phosphor glue in the traditional COB packaging structure, realize uniform phosphor coating, and eliminate color temperature dif...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/13H01L33/52F21S2/00F21Y101/02
Inventor 徐向阳唐建华
Owner JIANGSU SUN & MOON LIGHTING
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