Novel light-emitting diode (LED) packaging structure and packaging method capable of forming white light

An LED packaging, white light technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of prolonged packaging process time, increased production cost, uneven light spot, etc., to achieve optimal excitation efficiency, improve production efficiency, high color The effect of district achievement rate

Inactive Publication Date: 2012-06-13
FORYOU MULTIMEDIA ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the packaging method for achieving white light with low power includes the following steps. Use silver glue or transparent silica gel as the crystal-bonding glue to fix the LED chip on the substrate of the LED packaging bracket, and then connect the LED chip to the positive and negative poles of the LED packaging bracket through gold wires. Connect, refill the packaging glue, cover the LED chip, and the packaging glue is mixed with phosphor powder. This traditional packaging method of mixing phosphor powder into the packaging glue has the problem of phosphor precipitation, which leads to uneven light spots and discrete color areas. Therefore, in order to overcome this problem, it is necessary to increase the centrifugal precipitation equipment to precipitate the phosphor powder, that is, put the packaged LED package structure into the centrifugal precipitation equipment, let it rotate and revolve at the same time, so that the phosphor powder settles to the bottom of the packaging glue, so as to achieve the color In this traditional packaging method, due to the addition of centrifugal precipitation equipment for precipitation, on the one hand, the production cost is increased, and on the other hand, the step of precipitating phosphor powder is set, which makes the entire packaging process time longer and the production efficiency is low.
[0003] In addition, this encapsulation method of mixing phosphor powder into the encapsulant and then precipitating the phosphor powder to the bottom through centrifugal precipitation equipment will also produce the resulting encapsulation structure. The light output efficiency in the middle is normal white, while the surrounding light output efficiency is low. , forming a circle of yellowish light

Method used

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  • Novel light-emitting diode (LED) packaging structure and packaging method capable of forming white light
  • Novel light-emitting diode (LED) packaging structure and packaging method capable of forming white light

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Experimental program
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Embodiment 1

[0029] see figure 1 , the new LED packaging structure for achieving white light in this embodiment includes an LED packaging bracket, which includes a substrate 5 and a frame 1 surrounding the substrate 5, and an LED chip 3 is fixed on the substrate 5, that is, the bottom of the LED chip 3 It is fixed on the substrate 5 by a crystal-bonding glue mixed with phosphor powder. The LED chips are connected through gold wires 2 and connected to the positive and negative poles on the LED packaging support. The cavity formed between the substrate 5 and the frame 1 is filled with encapsulant 4 .

[0030] The novel LED encapsulation method for achieving white light of the present invention comprises the following steps:

[0031] 1) Add phosphor powder to the die-bonding glue;

[0032] 2) Fix the LED chip with the crystal-bonding glue added with phosphor powder in step 1) and the substrate of the LED packaging bracket; after fixing, dry the crystal-bonding glue at a drying temperature ...

Embodiment 2

[0039] The difference between the new LED packaging structure for achieving white light in this embodiment and the packaging structure in Embodiment 1 is that phosphor powder is also mixed into the packaging glue, and the rest are consistent with Embodiment 1, and will not be repeated here.

[0040] In this embodiment, the encapsulation method in which phosphor powder is mixed in both the encapsulation glue and the die-bonding glue, since the phosphor powder is mixed into the die-bonding glue at the bottom of the LED chip, the light emitted by the LED chip will produce diffuse reflection, and then After the phosphor powder is mixed into the upper encapsulant, it can enhance light scattering, obtain better excitation efficiency, better light color consistency, and obtain a higher color zone achievement rate. Therefore, the cooperation of these two aspects makes the light output uniform in all directions. The light extraction efficiency is improved, and the problem of yellow circ...

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Abstract

The invention discloses a novel light-emitting diode (LED) packaging structure capable of forming white light. The novel LED packaging structure comprises an LED packaging bracket. The LED packaging bracket comprises a substrate and a border enclosing the upper part of the substrate. An LED die is arranged in an area enclosed by the upper border of the substrate, bonded together with the substrate through a die bonder in which fluorescent powder is doped, connected through gold threads, and communicated to the anode and cathode of the LED packaging bracket. A packaging adhesive is filled in a space formed by the border and the substrate, and covers the LED die. The fluorescent powder is directly doped in the die bonder for bonding the LED die and the substrate of the LED packaging bracket, so that light reflected by the bottom of the LED die can directly contact the fluorescent powder to finish an excitation process, and long-waveband yellow light is emitted and forms the white light together with the blue light of the LED die. Compared with the prior art, the novel LED packaging structure eliminates a subsequent procedure for doping the fluorescent powder in the packaging adhesive and a procedure and equipment for centrifugal precipitation, improves production efficiency and decreases cost. The invention also discloses a novel LED packaging method capable of forming the white light.

Description

technical field [0001] The invention relates to the technical field of LED packaging, in particular to a novel LED packaging structure and packaging method for achieving white light. Background technique [0002] At present, the packaging method for achieving white light with low power includes the following steps. Use silver glue or transparent silica gel as the crystal-bonding glue to fix the LED chip on the substrate of the LED packaging bracket, and then connect the LED chip to the positive and negative poles of the LED packaging bracket through gold wires. Connect, refill the packaging glue, cover the LED chip, and the packaging glue is mixed with phosphor powder. This traditional packaging method of mixing phosphor powder into the packaging glue has the problem of phosphor precipitation, which leads to uneven light spots and discrete color areas. Therefore, in order to overcome this problem, it is necessary to increase the centrifugal precipitation equipment to precipi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/50H01L33/00
Inventor 张国波王建勇王峰
Owner FORYOU MULTIMEDIA ELECTRONICS
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