White light LED (light emitting diode) and packaging process thereof

Abstract

The invention relates to a packaging process of a white light LED (light emitting diode). The packaging process comprises a die bonding step, a wire bonding step, an adhesive preparing step, a dispensing step, a fluorescent powder precipitating step and an adhesive solidifying step, wherein in the fluorescent powder precipitating step, one of a centrifugal precipitation method, a baking precipitation method or a room temperature natural precipitation method is adopted or more of the centrifugal precipitation method, the baking precipitation method and the room temperature natural precipitation method are combined to ensure fluorescent adhesives to be divided into an upper packaging adhesive layer and a lower fluorescent powder layer covering an LED chip in a reflecting cup to ensure at least most fluorescent powder in the fluorescent adhesives to be precipitated on the fluorescent powder layer; and in the adhesive solidifying step, the reflecting cup after precipitation is continuously put in an oven to be baked to solidify the packaging adhesives in the reflecting cup and the packaging adhesives are taken out of the reflecting cup after being solidified. By adopting the packaging process, the problem that the light colors of the white light LEDs generated by the existing packaging processes of the white light LEDs have poorer consistency is mainly solved and the aim of ensuring the consistency of the light colors of the generated white light LEDs to be better is achieved.

Description

technical field [0001] The invention relates to a white light LED and a packaging process thereof. Background technique [0002] In the prior art, the packaging process steps of white light LEDs generally include a die bonding step→wire bonding step→glue making step→glue dispensing step. The dispensing step is to coat fluorescent glue around the LED chips in the reflective cup of the bracket, and the fluorescent glue is formed by mixing phosphor powder and encapsulation glue. In the dispensing step, due to the difference in the viscosity of the encapsulation glue, the particle size of the phosphor powder, and the dispensing time, all of them will affect the distribution position and density of the phosphor powder in the phosphor glue, which will lead to the luminous color of the white light LED. Due to the existing LED packaging method, because the distribution position of the phosphor powder is not well controlled, the LED produced by this method has poor light and color c...

AI Technical Summary

Problems solved by technology

In the dispensing step, due to the difference in the viscosity of the encapsulation glue, the particle size of the phosphor powder, and the dispensing time, all of them will affect the distribution position and density of the phosphor powder in the phosphor glue, which will lead to the luminous color of the white light LED. The existing LED packaging method, because the distribution position of the phosphor powder is not well controlled, the LED produced by this method has poor light and color consistency

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