Lens type SMD packaging device

A technology of packaging devices and lenses, which is applied in the field of lens-type SMD packaging devices, can solve the problems of application limitations, large light-emitting angles, and low brightness, and achieve the effects of good light color consistency, improved brightness, and high brightness

Inactive Publication Date: 2016-06-22
SHENZHEN JIUZHOU OPTOELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] For this reason, the technical problem to be solved by the present invention is that in the prior art, the SMD type LED has a large light-emitting angle and low brightness, and needs to be driven by a large cur

Method used

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  • Lens type SMD packaging device
  • Lens type SMD packaging device
  • Lens type SMD packaging device

Examples

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Embodiment

[0025] This embodiment provides a lens type SMD packaging device, such as Figure 1-3 As shown, it includes a bracket 1, at least two welding pads 2 are arranged on the inner bottom of the bracket 1, and a light-emitting chip 3 is correspondingly arranged above each of the welding pads 2, and a welding pad is arranged between the welding pads 2. 2 isolated baffles 4, the baffles 4 are light-tight insulating baffles, which can be made of PA6T, PA9T, PCT and other bracket plastic materials or materials such as EMC epoxy molding compounds, and the bottom of the baffles 4 is wide , the top is narrow, the top is flush with the top of the bracket 1, the baffle 4 isolates the light-emitting chip 3, so that the light-emitting angle and optical curve of each light-emitting source are consistent and do not affect each other, and the light color consistency is good. The narrow top and wide bottom of the baffle plate 4 will not block the light, and facilitate the divergence of the light. ...

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Abstract

The invention discloses a lens-type SMD packaging device, which includes a bracket, at least two welding pads are arranged on the inner bottom of the bracket, a light-emitting chip is correspondingly arranged above the welding pads, and welding pads are arranged between the welding pads. Isolated baffles. The pads are independent of each other, and the pads are separated by a partition, so that the luminous angle of the light emitted by the light-emitting chip above each pad is consistent with the optical curve and does not affect each other, and there will be no cross-lighting. High light overlap and good light color consistency. There is also an encapsulation lens above the light-emitting chip, which greatly improves the brightness of the LED device, and the curvature of the lens can be adjusted according to different needs to adjust the light-emitting angle and light-emitting curve of the device, so that the product can meet the requirements of high brightness, good light color consistency, Energy-saving market demand.

Description

technical field [0001] The invention belongs to the technical field of LED display, and in particular relates to a lens type SMD packaging device. Background technique [0002] Due to its advantages of high definition, stable quality, long life, and flexible display functions, LED display has become a high-tech display device that has been widely used in recent years. There will be considerable room for development in time. LED displays have high brightness, can be spliced ​​and used, and have high efficiency and low consumption. They are widely used in large-area display, such as advertising, finance, exhibition, sports, transportation and other fields. [0003] For outdoor occasions such as squares, large shopping malls, railways, and highways, outdoor LED displays are often used. Due to the complex outdoor environment, the display screens are required to be waterproof, dustproof, high temperature resistant, and lightning resistant. At present, in-line LED has good water...

Claims

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Application Information

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IPC IPC(8): H01L25/075H01L33/48H01L33/58
CPCH01L25/0753H01L33/483H01L33/58
Inventor 廖志伟刘君宏马振军龙小云熊周成
Owner SHENZHEN JIUZHOU OPTOELECTRONICS TECH
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