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Dispensing method applicable to flip chip

A flip chip and glue dispensing technology, which is applied to electrical components, circuits, semiconductor devices, etc., can solve problems such as poor consistency of finished products, low yield, light leakage of LED blue light chips, etc., to eliminate residual gas, enhance consistency, and simplify effect of complexity

Inactive Publication Date: 2012-08-15
厦门多彩光电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a dispensing method of LED fluorescent powder. Problems of poor consistency, low yield and light leakage of LED blue light chips

Method used

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Examples

Experimental program
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Embodiment Construction

[0026] The present invention will be further described in conjunction with specific embodiments.

[0027] The dispensing method applicable to flip chip of the present embodiment comprises the following steps:

[0028] Step A: making cured rubber particles: mix the AB glue with the fluorescent powder accounting for 7%-15% by weight of the AB glue evenly to make a liquid fluorescent glue. Wherein, glue A is a silica gel glue, glue B is a silica gel curing agent, and the fluorescent powder is a mixture of one or more of yellow fluorescent powder, green fluorescent powder, and red fluorescent powder.

[0029] Step B: Degassing the liquid fluorescent glue prepared in step A. All known methods can be used, such as heated air flotation, centrifugation and so on. In this embodiment, it is preferable to use a vacuum centrifugal mixer for degassing treatment, so as to eliminate residual gas in the liquid fluorescent glue formed by mixing. After the defoaming treatment, it is sealed. ...

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PUM

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Abstract

The invention relates to a dispensing method applicable to a flip chip. The dispensing method applicable to a flip chip comprises the following steps of: A, preparing curing colloidal particles: uniformly mixing AB glue and fluorescent powder accounting for 7-15% of the weight of AB glue, and preparing liquid fluorescent glue; B, defoaming the liquid fluorescent glue prepared in the step A and sealing, and quickly freezing at low temperature below 15 DEG C to obtain solid fluorescent glue; C, cutting the solid fluorescent glue prepared in the step B: putting the solid fluorescent glue in an atmosphere full of low-temperature nitrogen, cutting the solid fluorescent glue into uniform particles, and sealing the particles and storing in an environment below -15 DEG C, wherein the temperature of the low-temperature nitrogen is below -5 DEG C; and D, putting the uniform particles prepared in the step C in a light cup with a fixed flip chip, and roasting for forming.

Description

technical field [0001] The invention relates to a glue dispensing method for LED fluorescent powder, in particular to a glue dispensing method suitable for flip chips. Background technique [0002] LED has the advantages of long life, energy saving, good shock resistance, fast response, high reliability, environmental protection and safety, and is more and more widely used in the field of lighting. In the existing LED packaging process, the mainstream of white light technology is blue light chip plus phosphor excitation to generate white light, and the coating process of phosphor powder is directly related to the relevant indicators of white light LED. [0003] The existing glue dispensing method of white light LED phosphor mainly uses a glue dispenser to spot the mixture of phosphor powder and silica gel on the LED bracket. This process generally has the disadvantages of inconsistent LED light color, LED light color shift, uneven light color, and low light efficiency of LE...

Claims

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Application Information

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IPC IPC(8): H01L33/50
Inventor 郭盛辉
Owner 厦门多彩光电子科技有限公司
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