Method for efficiently packaging light-emitting diode (LED) chips by using substrate high diffuse reflection optical design

Abstract

The invention aims at providing a light-emitting diode (LED) packaging method capable of obtaining high luminous efficiency, low light attenuation and high light color uniformity in LED chip packaging by using a substrate with an optical design and high diffuse reflection (200-760nm waveband reflectivity R>=80%), and the method is applicable to packaging for various LED chips especially white light LED chips of the various LED chips. The substrate 10 for an LED is characterized in that surface treatment is conducted on the substrate 10 and a high diffuse reflection layer 102 is formed on the surface 101 of the substrate 10. An LED packaging structure is characterized by comprising electrodes 501 and 502, an LED chip 20 and sealing objects 40, wherein the electrodes 501 and 502 are formed on the substrate 10, the LED chip 20 is fixed on the high diffuse reflection layer 102 of the packaging substrate in die bonding mode, and the sealing objects cover the LED chip 20 and the high diffuse reflection layer 102. The LED packaging method has the advantages that the reflection cylindrical surface of light coming out from the bottom of the chip is expanded uniformly enough to form a large-angle sector surface (radian close to 170-degree KLMNOJ) through high diffuse reflection of the substrate surface, so that fluorescent powder can be excited and accordingly luminous efficiency higher than that of a traditional silver-plated mirror surface reflection film is obtained, and good light color uniformity is guaranteed.

Description

technical field [0001] The invention relates to a novel LED package substrate, in particular to a package substrate and a package method for improving LED light efficiency, reducing light attenuation and increasing light color uniformity. Background technique [0002] As a new type of light source, LED has achieved rapid development due to its incomparable advantages such as high efficiency, energy saving, green environmental protection, long life, fast startup speed, and no flicker. [0003] Generally speaking, the traditional white LED packaging structure, such as figure 1 , is mainly provided with a substrate A with a groove A1, a chip B is combined in the groove A1, and the chip B is connected to another support D through a connecting line C, and finally through the injection molding of a light-transmitting layer E, Combining the substrate A, the chip B, the connecting wire C and the sealant light-transmitting layer E into one body, completes the packaging of the LED. ...

AI Technical Summary

Problems solved by technology

However, this high-reflection film system will cause the reflected light to be concentrated, and more than 80% of the light is concentrated in a relatively narrow reflection area light column, such as figure 1 The dotted line F-G-H-I in the fan-shaped area has an angle of 60°, which leads to significant glare, especially for transparent sealants mixed with phosphor powder, the small laser surface will cause the area of ​​yellow light emitted by the phosphor powder to be very sensitive Limited, which will obviously affect the efficiency of LED light source

In addition, the high-reflection coating of the Ag film is prone to yellowing and discoloration during the high-temperature baking process, thereby reducing the reflectivity of the blue light band and reducing the light efficiency and color rendering index of the packaged LED.

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