Laser beam spot shape detection method and spot shape detection device

Abstract

The invention provides a spot shape detection method of laser line and a sport shape detection device. The method comprises the following steps: a transparent substrate plate positioning step for forming a transparent substrate with tiny prisms and positioing the plate which can be moved along the X axis direction vertical to Z axis and Y axis vertical to X axis and Y axis to an optical axis of laser line converged by a condenser; a laser line irradation step for converging outputted laser light which can not process the transparent substrate and irradating to the area where the tiny prism are located; a light intensity detection step for moving the transparent substrate relative to the condenser along the X axis direction and the Y axis direction, and detecting the light intensity after refraction; a light intensity mapping figure generating step for generating a light intensity mapping figure on x and y axis valve of the tiny prisms; and a spot shape figure shaping step for the condenser to apply the light intensity detection step and the light intensity mapping figure generating step, thereby generating a spot shape figure.

Description

technical field [0001] The present invention relates to a laser spot shape detection method and a spot shape detection device for detecting the spot shape of laser light oscillated from a laser beam oscillating member of a laser processor and converged by a condenser. Background technique [0002] In the semiconductor device manufacturing process, a plurality of regions are divided on the surface of a substantially disk-shaped semiconductor wafer by division lines formed in a lattice, and devices such as ICs and LSIs are formed in the divided regions. The semiconductor wafer formed in this way is cut along the planned dividing lines to divide the regions where the devices are formed, and manufacture individual devices. In addition, by cutting an optical device wafer on which a GaN-based compound semiconductor or the like is laminated on the surface of a sapphire substrate or a silicon carbide substrate along a planned dividing line, it is divided into individual optical devi...

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Problems solved by technology

[0008] Furthermore, the detection of the spot shape and spot position of the laser beam irradiated on workpieces such as wafers is carried out, for example, by positioning the spot of the laser beam on ground glass and aiming at the spot from the back side with a CCD camera. Imaging is performed, however, there is a problem that accurate light spot shape and spot position cannot be detected due to scattered light from ground glass

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