Component-level MEMS (macro-electro-mechanical systems) device active vibration isolator utilizing SMA (shape memory alloy)

Abstract

The invention provides a component-level MEMS (macro-electro-mechanical systems) device active vibration isolator utilizing SMA (shape memory alloy). The active vibration isolator is composed of a plurality of SMA micro elastic supports (12), a micro vibration isolating platform (13) with sockets (8), a connecting frame (4) and a plurality of pins (7) connected with the connecting frame (4). Two ends of the SMA micro elastic supports (12) are respectively connected with the micro vibration isolating platform (13) and the connecting frame (4). An MEMS device needed to be isolated from vibration is connected with the sockets (8) on the micro vibration isolating platform (13) through the pins of the active vibration isolator. Pin signals of the active vibration isolator are conducted onto the pins (7) on the connecting frame (4) through four flexible leads (9), and connected with outside circuits through the pins (7). The component-level MEMS device active vibration isolator has large damping and wide rigidity adjusting range, and is simple in structure and control system.

Description

technical field [0001] The invention belongs to the technical field of microelectromechanical systems (MEMS), and specifically relates to an active vibration isolator for element-level MEMS devices using SMA (Shape Memory Alloy, shape memory alloy). Component-level MEMS active vibration isolators. Background technique [0002] Micro-Electro-Mechanical Systems MEMS (Micro-Electro-Mechanical Systems) is a micro-electro-mechanical device or system that integrates micro-mechanical and micro-electronic functions. Devices based on MEMS technology (such as MEMS sensors and drivers) are small in size, light in weight, and sensitive. High and widely used, especially in the automotive and electronics industries. Many MEMS devices often need to work in harsh vibration environments. For example, MEMS sensors used in ordinary cars will withstand random vibration loads of 0-400Hz for a long time, while MEMS devices used on spacecraft will withstand random vibrations of 20-2000Hz during l...

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Problems solved by technology

[0014] The present invention mainly solves the problem that the component-level MEMS passive vibration isolator has small damping and the resonance frequency cannot be adjusted in the existing MEMS component-level vibration isolator technology, and the existing MEMS component-level active vibration isolator has small damping, active To solve the problems of narrow adjustment range and complex control system, a component-level MEMS active vibration isolator with large damping, wide stiffness variation range, simple structure and control system is provided.

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