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Method for producing integrated circuit (IC) smart card

A smart card and pattern technology, applied in the information field, can solve the problem of inconsistent concave depth of IC modules

Active Publication Date: 2013-08-14
SHANGHAI CHINA CARD SMART CARD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] In view of the above problems, the purpose of the present invention is to solve the problem of the inconsistency of the depth of the IC module in the existing IC smart card, and the depth of the depression can be adjusted very conveniently.

Method used

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  • Method for producing integrated circuit (IC) smart card
  • Method for producing integrated circuit (IC) smart card
  • Method for producing integrated circuit (IC) smart card

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Embodiment Construction

[0036] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.

[0037] see Figure 7 , an IC smart card, comprising a card base 40, a T-shaped IC module 30 and a first surface layer material 10, the card base 40 is provided with an IC module hole, and the size of the IC module corresponds to the IC module hole, and the IC module is arranged on After the IC module is inserted into the hole, the surface 10 of the IC module is flush with the surface of the card base. The first surface layer material covers the surface of the card base, and the first surface layer material is provided with hollow holes corresponding to the IC modules. The thickness of the first surface layer material is not greater than 0.15mm. The recessed depth of the IC module can be adjusted by the thickness of the first surface layer ma...

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Abstract

The invention discloses a method for producing an integrated circuit (IC) smart card. According to the IC smart card produced by the method, a height difference between the surface of an IC module and a card body is the thickness of a first surface layer material, and in addition, the first surface layer materials of the same type is low in thickness deviation, so that the sunken depth of the IC module is controllable and slight in deviation. The problem of height inconsistency of the IC module in the card body is solved, and the problem of incapability of ensuring that the surface of the IC module is lower than that of the card body in batch production is solved.

Description

technical field [0001] The invention relates to the field of information technology, in particular to a method for producing an IC smart card. Background technique [0002] At present, there are two production methods for producing contact IC smart cards and dual-interface IC smart cards, one is the milling method, and the other is the lamination method. [0003] The groove milling method first laminates the base of the IC smart card, and then mills out the IC module groove on the surface of the card base with a milling machine, puts the IC module with a hot-melt adhesive film on the back into it, and then heat-presses the IC module The hot-melt adhesive film on the back is melted, and the IC module and the card base are bonded together, and finally a contact IC smart card or a dual-interface IC smart card is obtained. Wherein, before the dual-interface IC module is put in, the welding pad on the IC module should be welded together with the metal antenna on the card base ma...

Claims

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Application Information

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IPC IPC(8): G06K19/07
Inventor 朱阁勇邱海涛
Owner SHANGHAI CHINA CARD SMART CARD CO LTD