Solder resist method for circuit board
A circuit board and solder resist technology, which is applied in the secondary treatment of printed circuits, coating non-metallic protective layers, etc., can solve the problems that solder resist materials cannot completely fill through holes, affect the solder resist performance of boards, and increase workload, etc. , to achieve a good solder mask effect, reduce processing costs, and reduce workload
Active Publication Date: 2013-08-14
珠海智锐科技有限公司
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Problems solved by technology
like figure 1 As shown, after one end of the through hole on the board body 1 is sealed by the CVL layer 3, due to the existence of air in the through hole when silk screen printing is performed on the other end of the through hole, there will be a phenomenon of poor exposure after the silk screen is completed, that is, the solder resist material The through-holes cannot be completely filled, and the formed solder resist layer 2 has defects, which will seriously affect the solder resist performance of the board
In order to overcome the above defects, the current general method is to perform plugging treatment before the silk screen solder mask material, which increases the workload and increases the cost
Method used
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Embodiment Construction
[0013] The invention improves the solder resisting process of the circuit board, and is specifically aimed at the structure of the circuit board in which through holes are provided on the board body. The invention overcomes the influence of through-holes during silk screen printing of the solder resist layer, so that the structure of the solder resist layer obtained by silk screen printing is complete.
[0014] Such as figure 2 As shown, the circuit board structure applicable to the present invention includes a board body 1, a solder resist layer 2, and a CVL layer 3, wherein the board body 1 generally consists of a PI layer in the middle and metal layers distributed on both sides of the PI layer. In order to form the above-mentioned circuit board structure, the present invention first pastes the CVL layer 3 on the surface of one side of the board body 1, and then drills the exhaust hole 31 on the position corresponding to the through hole of the CVL layer 3 and the board bod...
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The invention discloses a solder resist method for a circuit board. The circuit board comprises a board body; and a through hole is formed in the board body. The solder resist method for the circuit board comprises the following steps in sequence: sticking a CVL layer on the surface on one side of the board body; drilling an exhaust hole in the CVL layer in a position corresponding to the through hole of the board body; and coating a solder mask on the surface on the other side of the board body through screen printing. according to the method, the exhaust hole is drilled in the CVL layer on the other side before the step of screen printing of the solder mask, so that air in the through hole of the board body can be exhausted from the exhaust hole during screen printing of the solder mask, a screen printing material can be smoothly filled in the through hole, and the solder mask is integral and can achieve an excellent solder resist effect. The method omits a hole plugging step, is simple to implement and greatly reduces workload and processing cost.
Description
technical field [0001] The invention relates to a processing technology of a circuit board, in particular to a method for resisting soldering of a circuit board. Background technique [0002] Circuit boards generally need to be soldered during production, that is, after the circuit board completes the steps of wiring and drilling, the soldering process is performed by pasting the CVL layer (film-like cover film) and silk screen solder mask material. There will be through holes on the circuit board after drilling and other treatments, and the step of silk screen solder mask material is generally carried out after the CVL layer is pasted. Such as figure 1 As shown, after one end of the through hole on the board body 1 is sealed by the CVL layer 3, due to the existence of air in the through hole when silk screen printing is performed on the other end of the through hole, there will be a phenomenon of poor exposure after the silk screen is completed, that is, the solder resist ...
Claims
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IPC IPC(8): H05K3/28
Inventor 阙民辉魏志祥刘细辉
Owner 珠海智锐科技有限公司